CD74FCT374
- BiCMOS Technology With Low Quiescent Power
- 3-State Outputs Drive Bus Lines Directly
- Buffered Inputs
- Noninverted Outputs
- Input/Output Isolation From VCC
- Controlled Output Edge Rates
- 48-mA Output Sink Current
- Output Voltage Swing Limited to 3.7 V
- SCR Latch-Up-Resistant BiCMOS Process and Circuit Design
- Package Options Include Plastic Small-Outline (M) and Shrink Small-Outline (SM) Packages and Standard Plastic (E) DIP
The CD74FCT374 is an octal, edge-triggered, D-type flip-flop that uses a small-geometry BiCMOS technology and features 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The output stage is a combination of bipolar and CMOS transistors that limits the output high level to two diode drops below VCC. This resultant lowering of output swing (0 V to 3.7 V) reduces power-bus ringing [a source of electromagnetic interference (EMI)] and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration also enhances switching speed and is capable of sinking 48 mA.
The eight flip-flops enter data into their registers on the low-to-high transition of the clock (CLK). The output-enable (OE\) input controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.
A buffered OE\ input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components.
OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The CD74FCT374 is characterized for operation from 0°C to 70°C.
您可能會感興趣的類似產品
引腳對引腳的功能與所比較的產品相同
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | BiCMOS Octal Edge-Triggered D-Type Flip-Flop With 3-State Outputs datasheet | 2000年 7月 3日 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004年 6月 22日 | ||
| Selection guide | Advanced Bus Interface Logic Selection Guide | 2001年 1月 9日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點