CDCL1810A
- othersSingle 1.8 V Supply
- High-Performance Clock Distributor with 10 Outputs
- Low Input-to-Output Additive Jitter: as low as 10fs RMS
- Low-Voltage Differential Signaling (LVDS) Input, 100Ω
Differential On-Chip Termination, up to 650 MHz Frequency - Differential Current Mode Logic (CML) Outputs, 50Ω
Single-Ended On-Chip Termination, up to 650 MHz Frequency - Two Groups of Five Outputs Each with Independent Frequency
Division Ratios - Output Frequency Derived with Divide Ratios of 1, 2, 4, 5,
8, 10, 16, 20, 32, 40, and 80 - Meets ANSI TIA/EIA-644-A-2001 LVDS Standard Requirements
- Power Consumption: 410 mW Typical
- Output Enable Control for Each Output
- SDA/SCL Device Management Interface
- 48-pin VQFN (RGZ) Package
- Industrial Temperature Range: –40°C to +85°C
The CDCL1810A is a high-performance clock distributor. The programmable dividers, P0 and P1, give a high flexibility to the ratio of the output frequency to the input frequency: FOUT = FIN/P, where P (P0,P1) = 1, 2, 4, 5, 8, 10, 16, 20, 32, 40, 80.
The CDCL1810A supports one differential LVDS clock input and a total of 10 differential CML outputs. The CML outputs are compatible with LVDS receivers if they are ac-coupled.
With careful observation of the input voltage swing and common-mode voltage limits, the CDCL1810A can support a single-ended clock input as outlined in Pin Configuration and Functions.
All device settings are programmable through the SDA/SCL, serial two-wire interface. The serial interface is 1.8V tolerant only.
The device operates in a 1.8V supply environment and is characterized for operation from –40°C to +85°C. The CDCL1810A is available in a 48-pin QFN (RGZ) package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | CDCL1810A 1.8V, 10 Output, High-Performance Clock Distributor datasheet | PDF | HTML | 2014年 11月 5日 |
設計與開發
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CLOCK-TREE-ARCHITECT — 時鐘樹架構程式設計軟體
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN (RGZ) | 48 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。