CY74FCT2574T
- Function and Pinout Compatible With FCT and F Logic
- 25-
Output Series Resistors to Reduce Transmission-Line Reflection Noise - Reduced VOH (Typically = 3.3 V) Version of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- 3-State Outputs
- 12-mA Output Sink Current
15-mA Output Source Current - Edge-Triggered D-Type Inputs
- 250-MHz Typical Switching Rate
The CY74FCT2574T is a high-speed, low-power, octal D-type flip-flop featuring separate D-type inputs for each flip-flop. On-chip termination resistors at the outputs reduce system noise caused by reflections. The CY74FCT2574T can replace the CY74FCT574T to reduce noise in an existing design. This device has 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The CY74FCT2574T is identical to the CY74FCT2374T, except that on the CY74FCT2574T all outputs are on one side of the package and all inputs are on the other side. The flip-flops in the CY74FCT2574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | 8-Bit Register datasheet | 2001年 10月 11日 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004年 6月 22日 | ||
| User guide | CYFCT Parameter Measurement Information | 2001年 4月 2日 | ||
| Selection guide | Advanced Bus Interface Logic Selection Guide | 2001年 1月 9日 |
設計與開發
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14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOIC (DW) | 20 | Ultra Librarian |
| SSOP (DBQ) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點