ISO7231M
- 25 and 150-Mbps Signaling Rate Options
- Low Channel-to-Channel Output Skew;
1 ns Maximum - Low Pulse-Width Distortion (PWD);
2 ns Maximum - Low Jitter Content; 1 ns Typical at 150 Mbps
- Low Channel-to-Channel Output Skew;
- Typical 25-Year Life at Rated Working Voltage
(See Application Note SLLA197 and Figure 19) - 4-kV ESD Protection
- Operate With 3.3-V or 5-V Supplies
- 3.3-V and 5-V Level Translation
- High Electromagnetic Immunity
(See Application Note SLLA181) - –40°C to 125°C Operating Range
- Safety and Regulatory Approvals
- 4000-VPK Isolation per DIN V VDE V 0884-10
and DIN EN 61010-1 - 2500 VRMS Isolation for 1 minute per UL 1577
- CSA Component Acceptance Notice 5A and
IEC 60950-1 End Equipment Standard
- 4000-VPK Isolation per DIN V VDE V 0884-10
The ISO7230 and ISO7231 are triple-channel digital isolators each with multiple channel configurations and output enable functions. These devices have logic input and output buffers separated by TI’s silicon dioxide (SiO2) isolation barrier. Used in conjunction with isolated power supplies, these devices block high voltage, isolate grounds, and prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry.
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設計與開發
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DIGI-ISO-EVM — 通用數位隔離器評估模組
DIGI-ISO-EVM 是一款評估模組 (EVM),可評估任何 TI 單通道、雙通道、三通道、四通道或六通道數位隔離器裝置,並提供五種不同封裝 - 8 接腳窄體 SOIC (D)、8 接腳寬體 SOIC (DWV)、16 接腳寬體 SOIC (DWW)、16 接腳超寬體 SOIC (DWW) 和 16 接腳 (DBQ) 封裝。EVM 具備足夠 Berg 接腳選項,可用於評估具最少外部零組件的裝置。
ISO723X724XEVM — ISO723X724XEVM 評估模組
The ISO723X724X evaluation module (EVM) supports the rapid, parametric evaluation of the Triple and Quad Digital Isolators. The EVM will be delivered with an ISO7241C soldered on the board. If another device is desired, please order samples from www.ti.com. If you do not have the capability to (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。