RES60A-Q1
- AEC-Q200 qualified for automotive applications:
- Temperature grade 1: –40°C to +125°C
- High voltage rating:
- Survives 3+ HiPOT tests at 4000VDC (60s)
- 1700VDC creepage and clearance support between HVIN and LVIN (IEC-61010 PD 2)
- High dc precision with low shift and drift:
- Initial ratio matching precision: ±0.1% (max)
-
Low drift: ±1ppm/°C (typ)
- Accurate ±0.2% across aging and temperature
- Low thermal noise (1kHz) thin-film resistors:
- 30nV/√Hz (210:1 ratio)
- 25nV/√Hz (310:1 ratio)
- 22nV/√Hz (410:1 ratio)
- 20nV/√Hz (500:1 ratio)
- 18nV/√Hz (610:1 ratio)
- 14nV/√Hz (1000:1 ratio)
The RES60A-Q1 is a matched resistive divider, implemented in thin-film SiCr with Texas Instruments modern, high-performance, analog wafer process. A high quality SiO2 insulative layer encapsulates the resistors and enables usage at extremely high voltages, up to 1400VDC for sustained operation or 4000VDC for HiPOT testing (60s). The device has a nominal input resistance of RHV = 12.5MΩ, and is available in several nominal ratios to meet a wide array of system needs.
The RES60A-Q1 series features high ratio matching precision, with the measured ratio of each divider within ±0.1% (max) of the nominal. This precision is maintained over the specified temperature range and aging, with a cumulative drift of only ±0.2% (max). Therefore, the lifetime tolerance of an uncalibrated RES60A-Q1 remains within a ±0.3% (max) envelope.
The RES60A-Q1 is automotive qualified under AEC-Q200 temperature grade 1, with a specified temperature range from –40°C to +125°C. The device is offered in an 8-pin SOIC package, with nominal body size 7.5mm × 5.85mm, and features creepage and clearance distances of at least 8.5mm between the high-voltage and low-voltage pins.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | RES60A-Q1 Automotive, 1400VDC , Precision Resistive Divider datasheet | PDF | HTML | 2024年 9月 10日 |
Technical article | 整合式電阻分壓器如何提升 EV 電池系統性能 | PDF | HTML | 2024年 10月 14日 | |
Certificate | RES60EVM EU Declaration of Conformity (DoC) | 2024年 9月 10日 | ||
EVM User's guide | RES60 Evaluation Module User's Guide | PDF | HTML | 2024年 9月 5日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DWV) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點