SN54LS76A
- Package Options Include Plastic and Ceramic DIPs and Ceramic Flat Packages
- Dependable Texas Instruments Quality and Reliability
The '76 contains two independent J-K flip-flops with individual J-K, clock, preset, and clear inputs. The '76 is a positive-edge-triggered flip-flop. J-K input is loaded into the master while the clock is high and transferred to the slave on the high-to-low transition. For these devices the J and K inputs must be stable while the clock is high.
The 'LS76A contain two independent negative-edge-triggered flip-flops. The J and K inputs must be stable one setup time prior to the high-to-low clock transition for predictable operation. The preset and clear are asynchronous active low inputs. When low they override the clock and data inputs forcing the outputs to the steady state levels as shown in the function table.
The SN5476 and the SN54LS76A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN7476 and the SN74LS76A are characterized for operation from 0°C to 70°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Dual J-K Flip-Flops With Preset And Clear datasheet | 1988年 3月 1日 | |
| * | SMD | SN54LS76A SMD 7601301EA | 2016年 6月 21日 | |
| Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
| Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
| Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
| Application note | Designing with the SN54/74LS123 (Rev. A) | 1997年 3月 1日 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||
| Application note | Live Insertion | 1996年 10月 1日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| CDIP (J) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點