SN74CBTK6800
- 5- Switch Connection Between Two Ports
- TTL-Compatible Input Levels
- Power Off Disables Outputs, Permitting Live Insertion
- Outputs Are Precharged by Bias Voltage to Minimize Signal Distortion During Live Insertion
- Active-Clamp Undershoot-Protection Circuit on the I/Os Clamps Undershoots Down to \x962 V
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
The SN74CBTK6800 device provides ten bits of high-speed TTL-compatible bus switching. The low on-state resistance of the switch allows bidirectional connections to be made while adding near-zero propagation delay. The device also precharges the B port to a user-selectable bias voltage (BIASV) to minimize live-insertion noise.
The A and B ports have an active-clamp undershoot-protection circuit. When there is an undershoot, the active-clamp circuit is enabled and current from VCC is supplied to clamp the output, preventing the pass transistor from turning on.
The SN74CBTK6800 is organized as one 10-bit switch with a single enable (ON\) input. When ON\ is low, the switch is on, and port A is connected to port B. When ON\ is high, the switch between port A and port B is open. When ON\ is high or VCC is 0 V, B port is precharged to BIASV through the equivalent of a 10-k resistor.
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SSOP (DBQ) | 24 | Ultra Librarian |
TSSOP (PW) | 24 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點