SN74F573
- Eight Latches in a Single Package
- 3-State Bus-Driving True Outputs
- Full Parallel Access for Loading
- Buffered Control Inputs
- Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs
These 8-bit latches feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight latches of the ´F573 are transparent D-type latches. While the latch enable (LE) input is high, the Q outputs follow the data (D) inputs. When the latch enable is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
A buffered output enable
input can be used to place the eight outputs in either a normal logic
state (high or low logic levels) or a high- impedance state. In the
high-impedance state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and increased drive
provide the capability to drive bus lines without need for interface
or pullup components.
The output enable
input does not affect the internal operations of the latches. Old
data can be retained or new data can be entered while the outputs are
in the high-impedance state.
The SN54F573 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F573 is characterized for operation from 0°C to 70°C.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Octal Transparent D-Type Latches With 3-State Outputs datasheet (Rev. A) | 1993年 10月 1日 | |
White paper | Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) | PDF | HTML | 2024年 4月 30日 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997年 8月 1日 | ||
Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 |
設計與開發
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14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (N) | 20 | Ultra Librarian |
SOIC (DW) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點