SN74LS373
- Choice of Eight Latches or Eight D-Type Flip-Flops in a Single Package
- 3-State Bus-Driving Outputs
- Full Parallel Access for Loading
- Buffered Control Inputs
- Clock-Enable Input Has Hysteresis to Improve Noise Rejection (’S373 and ’S374)
- P-N-P Inputs Reduce DC Loading on Data Lines (’S373 and ’S374)
These 8-bit registers feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The high-impedance 3-state and increased high-logic-level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or pullup components. These devices are particularly attractive for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight latches of the LS373 and S373 are transparent D-type latches, meaning that while the enable (C or CLK) input is high, the Q outputs follow the data (D) inputs. When C or CLK is taken low, the output is latched at the level of the data that was set up.
The eight flip-flops of the LS374 and S374 are edge-triggered D-type flip-flops. On the positive transition of the clock, the Q outputs are set to the logic states that were set up at the D inputs.
Schmitt-trigger buffered inputs at the enable/clock lines of the S373 and S374 devices simplify system design as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered output-control (OC) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.
OC\ does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new data can be entered, even while the outputs are off.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Octal D-Type Transparent Latches And Edge-Triggered Flip-Flops datasheet (Rev. B) | 2002年 8月 23日 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
Application note | Designing with the SN54/74LS123 (Rev. A) | 1997年 3月 1日 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||
Application note | Live Insertion | 1996年 10月 1日 |
設計與開發
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14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (N) | 20 | Ultra Librarian |
SOIC (DW) | 20 | Ultra Librarian |
SOP (NS) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點