SN74LVC1T45
- ESD protection exceeds JESD 22:
- 2000V Human-Body Model (A114-A)
- 200V Machine Model (A115-A)
- 1000V Charged-Device Model (C101)
- Available in the Texas Instruments NanoFree™ package
- Fully configurable dual-rail design allows each port to operate over the full 1.65V to 5.5V power-supply range
- VCC isolation feature – if either VCC input is at GND, both ports are in the high-impedance state
- DIR input circuit referenced to VCCA
- Low power consumption, 4µA maximum ICC
- ±24mA output drive at 3.3V
- Ioff supports partial-power-down mode operation
- Maximum data rates
- 420Mbps (3.3V to 5V translation)
- 210Mbps (translate to 3.3V)
- 140Mbps (translate to 2.5V)
- 75Mbps (translate to 1.8V)
- Latch-up performance exceeds 100mA per JESD 78, Class II
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65V to 5.5V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65V to 5.5V. This allows for universal low-voltage bidirectional translation between any of the 1.8V, 2.5V, 3.3V, and 5V voltage nodes.
The SN74LVC1T45 is designed for asynchronous communication between two data buses. The logic levels of the direction-control (DIR) input activate either the B-port outputs or the A-port outputs. The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated. The input circuitry is always active on both A and B ports and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.
The SN74LVC1T45 is designed so that the DIR input is powered by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The VCC isolation feature is designed so that if either VCC input is at GND, then both ports are in the high-impedance state.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
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設計與開發
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點