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正反器、鎖存器和暫存器
D 型鎖存器
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邏輯和電壓轉換
正反器、鎖存器和暫存器
D 型鎖存器

SN74LVTH16373-EP

現行

具有 3 態輸出的增強型產品 3.3-V Abt 16 位元透明 D 型鎖存

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產品規格表

SN74LVTH16373-EP

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 16 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 5000 Features Bus-hold, Flow-through pinout, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating HiRel Enhanced Product
Number of channels 16 Technology family LVT Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 160 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 5000 Features Bus-hold, Flow-through pinout, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Operating temperature range (°C) -40 to 85 Rating HiRel Enhanced Product
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources
    (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus™ Family
  • State-of-the-Art Advanced BiCMOS Technology
    (ABT) Design for 3.3-V Operation and Low Static-
    Power Dissipation
  • Supports Mixed-Mode Signal Operation (5-V Input
    and Output Voltages With 3.3-V VCC)
  • Supports Unregulated Battery Operation Down to
    2.7 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V
    at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up Tri-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for
    External Pullup/Pulldown Resistors
  • Distributed VCC and GND Pins Minimize High-
    Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per
    JESD 17
  • ESD Protection Exceeds JESD 22
    • 4000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources
    (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus™ Family
  • State-of-the-Art Advanced BiCMOS Technology
    (ABT) Design for 3.3-V Operation and Low Static-
    Power Dissipation
  • Supports Mixed-Mode Signal Operation (5-V Input
    and Output Voltages With 3.3-V VCC)
  • Supports Unregulated Battery Operation Down to
    2.7 V
  • Typical VOLP (Output Ground Bounce) < 0.8 V
    at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up Tri-State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for
    External Pullup/Pulldown Resistors
  • Distributed VCC and GND Pins Minimize High-
    Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per
    JESD 17
  • ESD Protection Exceeds JESD 22
    • 4000-V Human Body Model (A114-A)
    • 200-V Machine Model (A115-A)

The SN74LVTH16373 is a 16-bit transparent D-type latch with tri-state outputs designed for low-voltage (3.3 V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs.

The SN74LVTH16373 is a 16-bit transparent D-type latch with tri-state outputs designed for low-voltage (3.3 V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs.
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技術文件

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類型 標題 日期
* Data sheet SN74LVTH16373-EP 3.3-V ABT 16-Bit Transparent D-Type Latch With Tri-State Outputs datasheet (Rev. B) PDF | HTML 2016年 6月 29日
* VID SN74LVTH16373-EP VID V6204712 2016年 6月 21日
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002年 5月 10日
Selection guide Advanced Bus Interface Logic Selection Guide 2001年 1月 9日
Application note LVT-to-LVTH Conversion 1998年 12月 8日
Application note LVT Family Characteristics (Rev. A) 1998年 3月 1日
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

設計與開發

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模擬型號

SN74LVTH16373 IBIS Model (Rev. C)

SCEM076C.ZIP (32 KB) - IBIS Model
下載
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SSOP (DL) 48 Ultra Librarian
TSSOP (DGG) 48 Ultra Librarian
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  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
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  • 組裝地點

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