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TS3A225E

現行

具自動麥克風和接地偵測的 100-mΩ 音訊插孔開關

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產品規格表

TS3A225E

現行
產品規格表 立即訂購

產品詳細資料

Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 4.5 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Rating Catalog
Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 4.5 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFF) 16 3.24 mm² 1.8 x 1.8 WQFN (RTE) 16 9 mm² 3 x 3
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

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檢視所有 6
類型 標題 日期
* Data sheet Autonomous Audio Headset Switch datasheet (Rev. A) 2013年 5月 29日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 2021年 11月 19日
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 2016年 3月 4日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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子卡

BOOSTXL-AUDIO — 音頻訊號處理 BoosterPack 插入式模組

When plugged into a LaunchPad™ Development Kit, the BOOSTXL-AUDIO Audio BoosterPack™ Plug-in Module can capture audio input from a microphone and output audio through an on-board speaker. Headphone input and output is also supported. This audio input/output stream lets developers (...)

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
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模擬型號

TS3A225E HSpice (LIN) Model

SCDM145.ZIP (483 KB) - HSpice Model
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模擬型號

TS3A225E HSpice (WIN) Model

SCDM146.ZIP (482 KB) - HSpice Model
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YFF) 16 Ultra Librarian
WQFN (RTE) 16 Ultra Librarian
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