Devices that have a THER pin allows for control over a specific fault that occurs: thermal shutdown faults. As with the LATCH pin, the THER pin can be pulled high or pulled low to configure different thermal shutdown behaviors, depending on what is desired. By pulling the THER pin high, the device will operate in latch mode after a thermal shutdown. When pulling the THER pin low, the device will operate in auto-retry mode. This can allow the device to recover when the device’s junction temperature is below the shutdown temperature by a set amount, although limiting the current as to prevent higher power dissipation and causing a repeated thermal shutdown. It is important to maintain a device temperature below the thermal shutdown threshold that can be caused by high currents in applications such as capacitive loads, and is described in the Section 2.3.