Product details

Package name SOT-23 IO capacitance (typ) (pF) 80 Tolerance (±) (%) 5 Vz (nom) (V) 8.2 IO leakage current (max) (nA) 500 Number of channels 1
Package name SOT-23 IO capacitance (typ) (pF) 80 Tolerance (±) (%) 5 Vz (nom) (V) 8.2 IO leakage current (max) (nA) 500 Number of channels 1
SOT-23 (DBZ) 3 6.9204 mm² 2.92 x 2.37
  • Total power dissipation: 250mW (max)
  • Low I/O capacitance: 80pF (max)
  • Low leakage current: 0.6µA (max)
  • Tolerance: ±5%
  • Temperature range: -55°C to +150°C
  • Leaded package used for automatic optical inspection (AOI)
  • Total power dissipation: 250mW (max)
  • Low I/O capacitance: 80pF (max)
  • Low leakage current: 0.6µA (max)
  • Tolerance: ±5%
  • Temperature range: -55°C to +150°C
  • Leaded package used for automatic optical inspection (AOI)

The BZX84Cx is a family of voltage regulating diodes in a SOT-23 package. The diodes are available in Zener voltages ranging from 8.2V to 39V.

The BZX84Cx is a family of voltage regulating diodes in a SOT-23 package. The diodes are available in Zener voltages ranging from 8.2V to 39V.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet BZX84Cx Zener Voltage Regulator Diodes in SOT-23 datasheet PDF | HTML 03 Dec 2024

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
SOT-23 (DBZ) 3 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos