CC1175
- High-Performance, Single-Chip Transmitter
- Very Low Phase Noise: –111 dBc/Hz at
10-kHz Offset
- Very Low Phase Noise: –111 dBc/Hz at
- High Spectral Efficiency (9.6 kbps in 12.5-kHz Channel in Compliance With FCC Narrowbanding Mandate)
- 128-Byte TX FIFO
- Support for Seamless Integration With the CC1190 Device for Increased Range Giving up to +27-dBm Output Power
- Programmable Output Power up to +16 dBm With 0.4-dB Step Size
- Power Supply
- Wide Supply Voltage Range (2.0 V to 3.6 V)
- Low Current Consumption:
- TX: 45 mA at +14 dBm
- Power Down: 0.12 μA (0.5 μA With Timer Running)
- Automatic Output Power Ramping
- Configurable Data Rates: 0 to 200 kbps
- Supported Modulation Formats: 2-FSK,
2-GFSK, 4-FSK, 4-GFSK, MSK, OOK - RoHS-Compliant 5-mm x 5-mm No-Lead QFN 32-Pin Package (RHB)
- Regulations – Suitable for Systems Targeting Compliance With
- Europe: ETSI EN 300 220, ETSI EN 54-25
- US: FCC CFR47 Part 15, FCC CFR47 Part 90, 24, and 101
- Japan: ARIB RCR STD-T30, ARIB STD-T67, ARIB STD-T108
- Peripherals and Support Functions
- TCXO Support and Control, also in Power Modes
- Optional Coding Gain Feature for Increased Range and Robustness
- Temperature Sensor
The CC1175 device is a fully integrated single-chip radio transmitter designed for high performance at very low-power and low-voltage operation in cost-effective wireless systems. All filters are integrated, thus removing the need for costly external SAW and IF filters. The device is mainly intended for the ISM (Industrial, Scientific, and Medical) and SRD (Short Range Device) frequency bands at 164–192 MHz, 274–320 MHz, 410–480 MHz, and 820–960 MHz.
The CC1175 device provides extensive hardware support for packet handling, data buffering, and burst transmissions. The main operating parameters of the CC1175 device can be controlled through an SPI interface. In a typical system, the CC1175 device will be used with a microcontroller and only a few external passive components.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
SMARTRFTRXEBK — SmartRF Transceiver Evaluation Board
The SmartRF Transceiver Evaluation Board (TrxEB) is intended to be used together with Texas Instruments’ low-power RF transceivers for evaluation, performance testing and software development.
The following transceiver evaluation modules are supported:
- CC1101EM*
- CC11xLEM*
- CC112xEM*
- CC1175EM*
- CC1200EM*
- (...)
CC1175EMK-868-915 — CC1175 Evaluation Module Kit 868-915MHz
The CC1175 Evaluation Module Kit for 868-915 MHz can be used in conjunction with the CC1120 Development Kit to evaluate the operation of the CC1175 at these particular frequency bands. The CC1120DK is required for operation and needs to be ordered separately.
SWRC219 — TrxEB RF PER Test Software
Supported products & hardware
Products
Sub-1 GHz transceivers
Hardware development
Development kit
SMARTRF-STUDIO-7 — SmartRF Studio 7 application software
SmartRF™ Studio is a Windows application that helps designers of RF systems to easily evaluate the radio at an early stage in the design process for all TI CC1xxx and CC2xxx low-power RF devices. It simplifies generation of the configuration register values and commands, as well as practical (...)
Supported products & hardware
Products
MSP430 microcontrollers
Low-power 2.4-GHz products
Sub-1 GHz wireless MCUs
Sub-1 GHz transceivers
Other wireless products
Automotive wireless connectivity products
Hardware development
Development kit
Evaluation board
Interface adapter
Daughter card
SIMPLELINK-SUB1GHZ-DESIGN-REVIEWS — Hardware design reviews for SimpleLink™ CC1xxx devices
- Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC1xxx product page links below).
- Step 2: (...)
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
VQFN (RHB) | 32 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Support & training
TI E2E™ forums with technical support from TI engineers
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