Produktdetails

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44, 72, 100 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-36, +/-50 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 14 ON-state leakage current (max) (µA) 0.07 Supply current (typ) (µA) 350 Bandwidth (MHz) 420 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 125 Rating Catalog Drain supply voltage (max) (V) 100 Supply voltage (max) (V) 100 Negative rail supply voltage (max) (V) -50
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44, 72, 100 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-36, +/-50 Protocols Analog Ron (typ) (Ω) 5 CON (typ) (pF) 14 ON-state leakage current (max) (µA) 0.07 Supply current (typ) (µA) 350 Bandwidth (MHz) 420 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 125 Rating Catalog Drain supply voltage (max) (V) 100 Supply voltage (max) (V) 100 Negative rail supply voltage (max) (V) -50
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • High supply voltage capable:
    • Dual supply: ±10 V to ±50 V
    • Single supply: 10 V to 100 V
    • Asymmetric dual supply operation
  • Consistent parametric across supply voltages

  • Latch-up immune
  • High continuous current: 200 mA

  • Low crosstalk: –110 dB
  • Low input leakage: 10 pA
  • Low On-Resistance flatness: 0.05 Ω
  • Low On-Resistance: 5 Ω
  • Low capacitance: 12 pF
  • Removes need for additional logic rail (V L)
  • 1.8-V Logic capable
  • Fail-safe logic: up to 48 V independent of supply
  • Integrated Pull-Down resistor on logic pins
  • Bidirectional signal path
  • Wide operating temperature T A: –40°C to 125°C
  • Industry-standard TSSOP and smaller WQFN packages
  • High supply voltage capable:
    • Dual supply: ±10 V to ±50 V
    • Single supply: 10 V to 100 V
    • Asymmetric dual supply operation
  • Consistent parametric across supply voltages

  • Latch-up immune
  • High continuous current: 200 mA

  • Low crosstalk: –110 dB
  • Low input leakage: 10 pA
  • Low On-Resistance flatness: 0.05 Ω
  • Low On-Resistance: 5 Ω
  • Low capacitance: 12 pF
  • Removes need for additional logic rail (V L)
  • 1.8-V Logic capable
  • Fail-safe logic: up to 48 V independent of supply
  • Integrated Pull-Down resistor on logic pins
  • Bidirectional signal path
  • Wide operating temperature T A: –40°C to 125°C
  • Industry-standard TSSOP and smaller WQFN packages

The TMUX8211, TMUX8212, and TMUX8213 are modern high voltage capable analog switches with Latch-Up immunity. Each device has four independently controllable 1:1, single-pole single-throw (SPST) switch channels. The devices work well with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The TMUX821x devices provide consistent analog parametric performance across the entire supply voltage range. The TMUX821x family supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins.

All logic inputs support logic levels of 1.8 V, 3.3 V, and 5 V and can be connected as high as 48 V, allowing for system flexibility with control signal voltage. Fail-safe logic circuitry allows voltages on the logic pins to be applied before the supply pin, protecting the device from potential damage.

The device family provides Latch-Up immunity, preventing undesirable high current events between parasitic structures within the device. A Latch-Up condition typically continues until the power supply rails are turned off and can lead to device failure. The Latch-Up immunity feature allows this family of multiplexers to be used in harsh environments.

The TMUX8211, TMUX8212, and TMUX8213 are modern high voltage capable analog switches with Latch-Up immunity. Each device has four independently controllable 1:1, single-pole single-throw (SPST) switch channels. The devices work well with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The TMUX821x devices provide consistent analog parametric performance across the entire supply voltage range. The TMUX821x family supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins.

All logic inputs support logic levels of 1.8 V, 3.3 V, and 5 V and can be connected as high as 48 V, allowing for system flexibility with control signal voltage. Fail-safe logic circuitry allows voltages on the logic pins to be applied before the supply pin, protecting the device from potential damage.

The device family provides Latch-Up immunity, preventing undesirable high current events between parasitic structures within the device. A Latch-Up condition typically continues until the power supply rails are turned off and can lead to device failure. The Latch-Up immunity feature allows this family of multiplexers to be used in harsh environments.

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Technische Dokumentation

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* Data sheet TMUX821x 100-V, Flat Ron, 1:1 (SPST), 4-Channel Switches with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. B) PDF | HTML 30 Mär 2023

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TMUX-24PW-EVM — TMUX generisches Evaluierungsmodul für 16-, 20- und 24-Pin-PW-Thin-Shrink-Small-Outline-Gehäuse (TSS

Das TMUX-24PW-EVM-Evaluierungsmodul ermöglicht das schnelle Prototyping und die DC-Charakterisierung der TMUX-Produktreihe von TI, die 16-, 20- oder 24-polige TSSOP-Gehäuse (PW) verwendet und für den Hochspannungsbetrieb ausgelegt ist.

Benutzerhandbuch: PDF | HTML
Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Benutzerhandbuch: PDF
Simulationsmodell

TMUX8211 IBIS Model

SCDM283.ZIP (40 KB) - IBIS Model
Simulationsmodell

TMUX8211 PSpice Model

SCDM279.ZIP (49 KB) - PSpice Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

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