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TX75E16

Name: TX75E16
Brand: TI
SKU: TX75E16
Price: 49.5 USD

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Datenblatt

document-pdfAcrobat TX75E16 5-Level, 16-Channel Transmitter with T/R Switch, On-Chip Beamformer, and Enhanced Load Damping Features datasheet (Englisch) PDF | HTML

TX75E16

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Datenblatt

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Produktdetails

Device type

Transmitter

Number of input channels

16

Active supply current (typ) (mA)

3.6

Supply voltage (max) (V)

5.5

Operating temperature range (°C)

0 to 70

Interface type

Serial

Rating

Catalog

Device type

Transmitter

Number of input channels

16

Active supply current (typ) (mA)

3.6

Supply voltage (max) (V)

5.5

Operating temperature range (°C)

0 to 70

Interface type

Serial

Rating

Catalog

FCCSP (ALH)

144

100 mm² 10 x 10

Transmitter supports:
- 16-channel 5-level pulser and active transmit/receive (T/R) switch
5-level pulser:
- Maximum output voltage: ±100 V
- Minimum output voltage: ±1 V
- Maximum output current: 2 A
- Supports 4-A output current mode.
- True return to zero to discharge output to ground
- Second harmonic of –45 dBc at 5 MHz
- –3-dB Bandwidth with 1-kΩ || 240-pF load
  - 20 MHz for a ±100-V supply
  - 25 MHz for a ±70-V supply
  - 35 MHz for a ±100-V supply in 4-A mode
- Integrated jitter: 100 fs measured from 100 Hz to 20 kHz
- CW mode close-in phase noise: –154 dBc/Hz at 1-kHz offset for 5-MHz signal
- Very low receive power: 1 mW/ch
- Programmable load damp resistor: 200 Ω, 100 Ω or 67 Ω
Active transmit/receive (T/R) switch with:
- Turn-on resistance: 8 Ω
- Turn-on and turn-off time: 100 ns
- Transient glitch: 10 mV PP
On-chip beam former with:
- Channel based T/R switch on and off controls
- Delay resolution: half beamformer clock period, minimum 2 ns
- Maximum delay: 2 14 beamformer clock period
- Maximum beamformer clock speed: 320 MHz
- Per channel pattern control with 2K distinct level
- Global and local repeat pattern, enabling long duration patterns for Shear Wave imaging
- Supports 120 delay profiles
High-speed (400 MHz maximum), 2-lane LVDS serial programming interface.
- Low programming time: < 500 ns for delay profile update
- 32-bit checksum feature to detect wrong SPI writes
Supports CMOS serial programming interface (50 MHz maximum)
Internal temperature sensor and automatic thermal shutdown
No specific power sequencing requirement
Error flag register to detect faulty conditions
Integrated passives for the floating supplies and bias voltages
Small package: FC-BGA-144 (10 mm × 10 mm) with 0.8-mm pitch

Transmitter supports:
- 16-channel 5-level pulser and active transmit/receive (T/R) switch
5-level pulser:
- Maximum output voltage: ±100 V
- Minimum output voltage: ±1 V
- Maximum output current: 2 A
- Supports 4-A output current mode.
- True return to zero to discharge output to ground
- Second harmonic of –45 dBc at 5 MHz
- –3-dB Bandwidth with 1-kΩ || 240-pF load
  - 20 MHz for a ±100-V supply
  - 25 MHz for a ±70-V supply
  - 35 MHz for a ±100-V supply in 4-A mode
- Integrated jitter: 100 fs measured from 100 Hz to 20 kHz
- CW mode close-in phase noise: –154 dBc/Hz at 1-kHz offset for 5-MHz signal
- Very low receive power: 1 mW/ch
- Programmable load damp resistor: 200 Ω, 100 Ω or 67 Ω
Active transmit/receive (T/R) switch with:
- Turn-on resistance: 8 Ω
- Turn-on and turn-off time: 100 ns
- Transient glitch: 10 mV PP
On-chip beam former with:
- Channel based T/R switch on and off controls
- Delay resolution: half beamformer clock period, minimum 2 ns
- Maximum delay: 2 14 beamformer clock period
- Maximum beamformer clock speed: 320 MHz
- Per channel pattern control with 2K distinct level
- Global and local repeat pattern, enabling long duration patterns for Shear Wave imaging
- Supports 120 delay profiles
High-speed (400 MHz maximum), 2-lane LVDS serial programming interface.
- Low programming time: < 500 ns for delay profile update
- 32-bit checksum feature to detect wrong SPI writes
Supports CMOS serial programming interface (50 MHz maximum)
Internal temperature sensor and automatic thermal shutdown
No specific power sequencing requirement
Error flag register to detect faulty conditions
Integrated passives for the floating supplies and bias voltages
Small package: FC-BGA-144 (10 mm × 10 mm) with 0.8-mm pitch

The TX75E16 is a highly integrated, high-performance transmitter for ultrasound imaging system. The device has total 16 pulser circuits, 16 transmit/receive switches (referred as T/R or TR switches), and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

The TX75E16 has a pulser circuit that generates five-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 16 outputs. The maximum output current is 2 A.

The device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

The TX75E16 (referred as device in this data sheet) is highly integrated transmitter targeted for exciting ultrasound transducers. Device integrates 16 pulsers and 16 T/R switches, on-chip beamformer, and pattern generator.

The device integrates all the decoupling capacitors required for the floating supplies and internal bias voltages. This integration significantly reduces the required number of external capacitors. The TX75E16 is available in a 10-mm × 10-mm 144-pin FC-BGA package (ALH package) and is specified for operation from 0°C to 70°C.

Pulser circuit generates five-level high voltage pulses (up to ±100 V) with maximum output current of 2 A. When pulser transmits the high voltage pulses, T/R switch turns OFF and protects the low voltage receiver circuit from damage. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is controlled by on-chip beamforming engine in the device. The T/R switch offers 8-Ω impedance in the ON state.

Ultrasound transmission relies on excitation of multiple transducer elements, with different delay values defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX75E16 supports staggered pulsing of the different channels, allowing for transmit beamforming.

In the on-chip beamformer mode, delay profile for pulsing of different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 2 14 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Each channel has a RAM, which is 960 words long. The patterns have global and local repeats feature. This capability can be used to generate long patterns and can be used in Shear-Wave imaging.

These pattern profiles and delay profiles are written using a high-speed (400 MHz) serial peripheral interface. The high-speed writes can be prone to errors, therefore the device has a checksum feature to detect errors in SPI writes.

To protect the device from getting damaged because of improper configuration, an internal error flag register can detect faulty condition and configure the device in shutdown mode automatically.