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NEU CC3301MOD VORSCHAU SimpleLink™ Wi-Fi 6- und Bluetooth® Low Energy-Companion-Modul Certified modules with upgraded functionality of Wi-Fi 6 and Bluetooth Low Energy

Produktdetails

Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Rating Catalog Operating temperature range (°C) -40 to 105
Processor External MPU Type Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Rating Catalog Operating temperature range (°C) -40 to 105
DSBGA (YFV) 130 22.87520000000000493 mm² 4.640000000000001 x 4.93
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet WL18x1 WiLink™ 8 Single-Band Combo Device Supporting Wi-Fi® , Bluetooth® , and Bluetooth® Low Energy datasheet PDF | HTML 14 Mai 2021
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 22 Aug 2023
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 02 Aug 2023
Application note CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices (Rev. A) PDF | HTML 20 Okt 2022
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mär 2022
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 20 Dez 2021
Cybersecurity advisory Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 27 Mai 2021
Cybersecurity advisory FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 19 Mai 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 Jan 2021
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 27 Okt 2020
White paper Charging stations: Toward an EV support infrastructure 09 Mai 2017

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Software-Entwicklungskit (SDK)

PROCESSOR-SDK-LINUX-AM335X Linux Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
WLAN-Produkte
WL1807MOD WiLink™ 8 industrielles Dual-Band-Kombimodul, 2 x 2 MIMO Wi-Fi-Modul WL1831 WiLink™8 industrieller Single-Band-Transceiver für Wi-Fi®, Bluetooth® und Bluetooth Low Energy WL1837MOD Industrielles Dual-Band-Modul für WiLink™ 8 mit 2x2 MIMO Wi-Fi®, Bluetooth® /Bluetooth Smart-Modul
ARM-basierte Prozessoren
AM3351 Sitara-Prozessor: Arm Cortex-A8, 1Gb Ethernet, Display AM3352 Sitara-Prozessor: Arm Cortex-A8, 1Gb Ethernet, Display, CAN AM3354 Sitara-Prozessor: Arm Cortex-A8, 3D Grafikkarten, CAN AM3356 Sitara-Prozessor: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Sitara-Prozessor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Sitara-Prozessor: Arm Cortex-A8, 3D-Grafiken, PRU-ICSS, CAN AM3359 Sitara-Prozessor: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN
Hardware-Entwicklung
Evaluierungsplatine
TMDSICE3359 Industrial Communications Engine AM3359 TMDSSK3358 AM335x-Starterkit TMDXEVM3358 AM335x-Evaluierungsmodul
Download-Optionen
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-LINUX-RT-AM335X Linux-RT Processor SDK for AM335x

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
WLAN-Produkte
WL1807MOD WiLink™ 8 industrielles Dual-Band-Kombimodul, 2 x 2 MIMO Wi-Fi-Modul WL1831 WiLink™8 industrieller Single-Band-Transceiver für Wi-Fi®, Bluetooth® und Bluetooth Low Energy WL1837MOD Industrielles Dual-Band-Modul für WiLink™ 8 mit 2x2 MIMO Wi-Fi®, Bluetooth® /Bluetooth Smart-Modul
ARM-basierte Prozessoren
AM3351 Sitara-Prozessor: Arm Cortex-A8, 1Gb Ethernet, Display AM3352 Sitara-Prozessor: Arm Cortex-A8, 1Gb Ethernet, Display, CAN AM3354 Sitara-Prozessor: Arm Cortex-A8, 3D Grafikkarten, CAN AM3356 Sitara-Prozessor: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Sitara-Prozessor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Sitara-Prozessor: Arm Cortex-A8, 3D-Grafiken, PRU-ICSS, CAN AM3359 Sitara-Prozessor: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN
Hardware-Entwicklung
Evaluierungsplatine
TMDSICE3359 Industrial Communications Engine AM3359 TMDXEVM3358 AM335x-Evaluierungsmodul
Download-Optionen
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-RTOS-AM335X TI-RTOS Processor SDK for AM335x and AMIC110 devices (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
WLAN-Produkte
WL1807MOD WiLink™ 8 industrielles Dual-Band-Kombimodul, 2 x 2 MIMO Wi-Fi-Modul WL1831 WiLink™8 industrieller Single-Band-Transceiver für Wi-Fi®, Bluetooth® und Bluetooth Low Energy WL1837MOD Industrielles Dual-Band-Modul für WiLink™ 8 mit 2x2 MIMO Wi-Fi®, Bluetooth® /Bluetooth Smart-Modul
ARM-basierte Prozessoren
AM3351 Sitara-Prozessor: Arm Cortex-A8, 1Gb Ethernet, Display AM3352 Sitara-Prozessor: Arm Cortex-A8, 1Gb Ethernet, Display, CAN AM3354 Sitara-Prozessor: Arm Cortex-A8, 3D Grafikkarten, CAN AM3356 Sitara-Prozessor: Arm Cortex-A8, PRU-ICSS, CAN AM3357 Sitara-Prozessor: Arm Cortex-A8, EtherCAT, PRU-ICSS, CAN AM3358 Sitara-Prozessor: Arm Cortex-A8, 3D-Grafiken, PRU-ICSS, CAN AM3359 Sitara-Prozessor: Arm Cortex-A8, EtherCAT, 3D, PRU-ICSS, CAN AMIC110 Sitara-Prozessor: Arm Cortex-A8, über 10 Ethernet-Protokolle
Hardware-Entwicklung
Evaluierungsplatine
TMDSICE3359 Industrial Communications Engine AM3359 TMDSSK3358 AM335x-Starterkit TMDXEVM3358 AM335x-Evaluierungsmodul TMDXICE110 AMIC110-Modul für Industriekommunikation (ICE)
Download-Optionen
Anwendungssoftware und Frameworks

WILINK-BT_WIFI-WIRELESS_TOOLS — WiLink™ Drahtlos-Tools für WL18XX Module

Dieses Paket enthält die folgenden Anwendungen:
  • WLAN Real-Time Tuning Tool (RTTT)
  • Bluetooth® Logger
  • WLAN gLogger
  • Link Quality Monitor (LQM)
  • HCITester Tool
    • BTSout
    • BTSTransform
    • ScriptPad

Die Anwendungen bieten alle Funktionen, die zum Debuggen und Überwachen von WiLink™ WLAN/Bluetooth/Bluetooth Low (...)

Benutzerhandbuch: PDF | HTML
Anwendungssoftware und Frameworks

WILINK-WIFI_MESH_VISUALIZATION_TOOL — WiLink™ Mesh-Visualisierungstool für WL18XX-Module

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
Benutzerhandbuch: PDF
Treiber oder Bibliothek

TI-BT-STACK-LINUX-ADDON — TI Bluetooth Linux Add-on für AM335x EVM, AM437x EVM und BeagleBone mit WL18xx und CC256x

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
Treiber oder Bibliothek

WILINK8-WIFI-NLCP WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
WLAN-Produkte
WL1801 Industrieller WiLink™ 8-Einzelband-Transceiver für Wi-Fi® WL1801MOD WiLink™ 8-Einzelband-Wi-Fi®-Modul WL1805MOD WiLink™ 8 Single-Band, 2x2 MIMO Wi-Fi®-Modul WL1807MOD WiLink™ 8 industrielles Dual-Band-Kombimodul, 2 x 2 MIMO Wi-Fi-Modul WL1831 WiLink™8 industrieller Single-Band-Transceiver für Wi-Fi®, Bluetooth® und Bluetooth Low Energy WL1831MOD WiLink™ 8 Industrial Wi-Fi, Bluetooth und Bluetooth Smart (Low Energy)-Modul WL1835MOD WiLink™ 8 Single-Band-Kombimodul 2x2 MIMO Wi-Fi ®, Bluetooth® und Bluetooth Smart-Modul WL1837MOD Industrielles Dual-Band-Modul für WiLink™ 8 mit 2x2 MIMO Wi-Fi®, Bluetooth® /Bluetooth Smart-Modul
Download-Optionen
Treiber oder Bibliothek

WL18XX-BT-SP — Bluetooth-Servicepack für WL18xx

The Bluetooth Service Pack is composed of the following four files:

  • BTS file (TIInit_11.8.32.bts)
  • ILI file (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • Release Notes Document
  • License Agreement

Note the version in the file name is unique for combination of hardware and firmware, but is not (...)

Benutzerhandbuch: PDF
Support-Software

CLRNX-3P-CLARIFI — Clarinox ClariFi Integrierter Drahtlos-Debugger

ClariFi™ bietet eine integrierte Protokollanalysator-Unterstützung für ein schnelleres Debugging komplexer Drahtlosgeräte und wird mit unserer benutzerfreundlichen SoftFrame Abstraction Layer-Middleware verwendet. Es bietet Threading, Speicherauslastung und Speicherleckanalyse. Zusammen (...)
Von: Clarinox
Support-Software

CLRNX-3P-CLARINOX-BLUE — ClarinoxBlue Integrierter Bluetooth® Protocol Stack

Der ClarinoxBlue™ Protocol Stack wurde von Embedded-Entwicklern für Embedded-Entwickler entwickelt. Dank des einfachen und flexiblen Ansatzes des ClarinoxBlue-Protokollstacks können Sie mehr Zeit in die Entwicklung Ihrer Anwendungen investieren. Sie müssen sich nicht mehr mit den Einzelheiten der (...)
Von: Clarinox
Support-Software

CLRNX-3P-CLARINOX-WIFI — ClarinoxWiFi Integrierter WLAN-Protokollstack

ClarinoxWiFi ist ein bewährter WLAN-Protokollstack mit AP-, STA-, P2P- und Mesh-Rollen, der eine große Bandbreite verschiedener RTOS/MCUs unterstützt. Mit ClarinoxWiFi können Entwickler zuverlässige und leistungsfähige WLAN-Verbindungen für eine Vielzahl von drahtlosen Embedded-Anwendungen (...)
Von: Clarinox
Designtool

3P-WIRELESS-MODULES — Suchtool für drahtlose Module von Drittanbietern

Das Suchtool für drahtlose Module von Drittanbietern unterstützt Entwickler dabei, Produkte zu finden, welche ihren Endgerätespezifikationen entsprechen, und produktionsbereite Drathlosmodule zu beschaffen. Die im Suchtool enthaltenen Verkäufer von Drittanbietermodulen sind unabhängige (...)
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
DSBGA (YFV) 130 Ultra Librarian

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  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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  • Werksstandort
  • Montagestandort

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