Eine neuere Version dieses Produkts ist verfügbar

Ähnliche Funktionalität wie verglichener Baustein
NEU CC3301MOD VORSCHAU SimpleLink™ Wi-Fi 6- und Bluetooth® Low Energy-Companion-Modul Upgraded functionality with Wi-Fi 6 and Bluetooth Low Energy

Produktdetails

Processor External MPU Type Module, Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 2x2 MIMO, 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, STA, Wi-Fi direct mode Certifications CE, FCC, ISED, MIC Rating Catalog Operating temperature range (°C) -20 to 70
Processor External MPU Type Module, Transceiver Protocols Combo (Wi-Fi + Bluetooth), Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Security Networking security (WPA3) Features 2x2 MIMO, 802.11bgn, AP, Bluetooth, Bluetooth low energy, COEX, STA, Wi-Fi direct mode Certifications CE, FCC, ISED, MIC Rating Catalog Operating temperature range (°C) -20 to 70
QFM (MOC) 100 178.22 mm² 13.3 x 13.4
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –20°C to +70°C
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy (WL183xMOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management
    • Quick hardware design with TI module collateral and reference designs
    • Operating temperature: –20°C to +70°C
    • Small form factor: 13.3 × 13.4 × 2 mm
    • 100-pin MOC package
    • FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
  • Wi-Fi
    • WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC support for extended range
    • Fully calibrated: production calibration not required
    • 4-bit SDIO host interface support
    • Wi-Fi direct concurrent operation (multichannel, multirole)
  • Bluetooth and Bluetooth low energy (WL183xMOD only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support of SBC encoding + A2DP
    • Dual-mode Bluetooth and Bluetooth low energy
    • TI’s Bluetooth and Bluetooth low energy certified stack
  • Key benefits
    • Reduces design overhead
    • Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
    • Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
    • Different provisioning methods for in-home devices connectivity to Wi-Fi in one step
    • Lowest Wi-Fi power consumption in connected idle (< 800 µA)
    • Configurable wake on WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 40
Typ Titel Datum
* Data sheet WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band Combo Module – Wi-Fi®, Bluetooth®, and Bluetooth Low Energy (LE) datasheet (Rev. N) PDF | HTML 26 Apr 2021
* Radiation & reliability report WL1835MOD Reliability Data - Reliability Estimate 27 Jul 2017
Cybersecurity advisory Buffer Overflow in WL18xx MCP Driver (Rev. A) PDF | HTML 22 Aug 2023
Cybersecurity advisory WiLink WL18xx PN Reuse Issue PDF | HTML 02 Aug 2023
Application note Antenna Impedance Measurement and Matching PDF | HTML 22 Mär 2022
Selection guide Leitfaden zur Auswahl drahtloser Kommunikationstechnologie (Rev. B) 07 Mär 2022
User guide WiLink8 Getting Started Guide (Rev. B) PDF | HTML 20 Dez 2021
User guide WL1835MODCOM8 WLAN MIMO/BT Module Board (Rev. F) PDF | HTML 17 Dez 2021
Cybersecurity advisory Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 27 Mai 2021
Cybersecurity advisory FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 19 Mai 2021
Certificate WL18MODGB (Test Grade 35: WL1835MODGBMOC) EC DoC (Rev. A) 03 Mär 2021
White paper WiLink8 Use Case Guide PDF | HTML 30 Dez 2020
User guide WiLink8 Driver Debug PDF | HTML 07 Dez 2020
User guide WiLink8 Linux Advanced Demos PDF | HTML 07 Dez 2020
User guide WiLink8 R8.8 Linux Wi-Fi Driver Release Build User's Guide (Rev. A) PDF | HTML 27 Okt 2020
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 Mai 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 Mai 2020
Product overview Sitara™ processors + WiLink™ 8 Wi-Fi® + Bluetooth® combo connectivity (Rev. A) 30 Jul 2019
User guide WL18xx Module Hardware Integration Guide (Rev. B) PDF | HTML 09 Jul 2019
Design guide WL18xx Design Checklist 27 Jun 2019
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 Jan 2019
User guide WiLink™ 8.0 Bluetooth® Vendor-Specific HCI Commands (Rev. B) 17 Okt 2017
Application note Secure Connection Capability for WiLink Bluetooth 4.2 19 Mai 2017
More literature Streamline the challenges of RF design with certified wireless modules 25 Jan 2017
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans MCP 28 Dez 2016
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans NLCP 28 Dez 2016
Application note WiLink 8.0TM WLAN IP Mesh Application Report 01 Jun 2016
User guide WiLinkT™ 8 WLAN Features User's Guide (Rev. A) PDF | HTML 26 Mai 2016
White paper Wi-Fi® mesh networks: Discover new wireless paths 24 Mai 2016
White paper Streaming Audio: Follow the signal chain white paper 14 Apr 2016
Application note Certification Testing Guidelines for WFA System Interoperability Test Plans 15 Feb 2016
More literature WiLink 8 Wi-Fi + Bluetooth/BLE Modules (Rev. B) 03 Feb 2016
Application note Precise Time Synchronization Over WLAN (Rev. A) 18 Dez 2015
Application note WL18xx .INI File (Rev. A) 03 Dez 2015
White paper Wi-Fi® audio: capabilities and challenges 02 Dez 2015
Application note Enhanced HCILL: Four-Wire Power Management Protocol (Rev. B) 24 Sep 2015
Application note WL18xx Level-shifting I/O (Rev. A) 19 Aug 2015
Application note WiLink 8 Solutions WiLink8 - wlconf Manual 01 Jul 2015
White paper Complete solutions for next-generation wireless connected audio 02 Jan 2014
White paper A Smarter Grid With The Internet of Things 21 Okt 2013

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

TMDSEVM437X — AM437x-Evaluierungsmodul

Das AM437x-Evaluierungsmodul (EVM) TMDXEVM437X ermöglicht Entwicklern den schnellen Einstieg in die Evaluierung der AM437x-Prozessorfamilie (AM4372, AM4376, AM4377, AM4378), die Realisierung von Anwendungen sowie die schnellere Entwicklung von Anwendungen in den Bereichen HMI, Industrie und (...)

Benutzerhandbuch: PDF
Evaluierungsplatine

TMDSEVM572X — AM572x-Evaluierungsmodul

The AM572x evaluation module provides an affordable platform to quickly start evaluation of Sitara™ Arm® Cortex®-A15 AM57x processors (AM5728AM5726AM5718AM5716) and accelerate development for HMI, machine vision, networking, medical imaging and many other industrial applications. It is a (...)

Benutzerhandbuch: PDF
Evaluierungsplatine

TMDXEVM3358 — AM335x-Evaluierungsmodul

The AM335x Evaluation Module (EVM) enables developers to immediately start evaluating the AM335x processor family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications for factory automation, building automation, grid infrastructure, and more.

Benutzerhandbuch: PDF
Evaluierungsplatine

WL18XXCOM82SDMMC — WL18XXCOM82SDMMC

The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8 Evaluation module [WL1837MODCOM8i and WL1835MODCOM8B] and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides (...)

Benutzerhandbuch: PDF
Tochterkarte

WL1835MODCOM8B — WiLink™ 8 Modul, 2,4 GHz, WiFi® + Bluetooth® COM8 – Evaluierungsmodul

TI WiLink™ 8 module family

The WL1835MODCOM8 is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5 GHz band and extended temperature range, see the WL1837MODCOM8I.

The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add (...)

Benutzerhandbuch: PDF | HTML
Software-Entwicklungskit (SDK)

PROCESSOR-SDK-AM335X — Prozessor-SDK für AM335x Sitara-Prozessoren für Linux und TI-RTOS-Support

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
Software-Entwicklungskit (SDK)

TIBLUETOOTHSTACK-SDK — Dual-Mode Bluetooth®-Stack von TI

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

Benutzerhandbuch: PDF | HTML
Anwendungssoftware und Frameworks

WILINK-BT_WIFI-WIRELESS_TOOLS — WiLink™ Drahtlos-Tools für WL18XX Module

Dieses Paket enthält die folgenden Anwendungen:
  • WLAN Real-Time Tuning Tool (RTTT)
  • Bluetooth® Logger
  • WLAN gLogger
  • Link Quality Monitor (LQM)
  • HCITester Tool
    • BTSout
    • BTSTransform
    • ScriptPad

Die Anwendungen bieten alle Funktionen, die zum Debuggen und Überwachen von WiLink™ WLAN/Bluetooth/Bluetooth Low (...)

Benutzerhandbuch: PDF | HTML
Anwendungssoftware und Frameworks

WILINK-WIFI_MESH_VISUALIZATION_TOOL — WiLink™ Mesh-Visualisierungstool für WL18XX-Module

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
Benutzerhandbuch: PDF
Treiber oder Bibliothek

TI-BT-4-2-STACK-LINUX-ADDON — TI Bluetooth 4.2 Stack Add-On für Linux-Plattformen mit WL183x und CC2564C

This package contains the install package, pre-compiled object of the TI Bluetooth Stack and Platform Manager, and pre-compiled object with source of sample applications to easily upgrade the default LINUX EZSDK Binary on an AM335x EVM. The software was built with Linaro GCC 4.7 and can be added to (...)
Treiber oder Bibliothek

TI-BT-STACK-LINUX-ADDON — TI Bluetooth Linux Add-on für AM335x EVM, AM437x EVM und BeagleBone mit WL18xx und CC256x

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
Treiber oder Bibliothek

WILINK8-WIFI-MCP8 — WiLink™ 8 proprietärer WLAN-Treiber – QNX, WinCE, Nucleus RTOS-Basis

The MCP package contains the install package, pre-compiled object and source of the proprietary Wi-Fi Driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through (...)

Benutzerhandbuch: PDF | HTML
Treiber oder Bibliothek

WILINK8-WIFI-NLCP WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide

Software block overview:

WL18xx Linux driver uses the open source components along with the interface (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
WLAN-Produkte
WL1801 Industrieller WiLink™ 8-Einzelband-Transceiver für Wi-Fi® WL1801MOD WiLink™ 8-Einzelband-Wi-Fi®-Modul WL1805MOD WiLink™ 8 Single-Band, 2x2 MIMO Wi-Fi®-Modul WL1807MOD WiLink™ 8 industrielles Dual-Band-Kombimodul, 2 x 2 MIMO Wi-Fi-Modul WL1831 WiLink™8 industrieller Single-Band-Transceiver für Wi-Fi®, Bluetooth® und Bluetooth Low Energy WL1831MOD WiLink™ 8 Industrial Wi-Fi, Bluetooth und Bluetooth Smart (Low Energy)-Modul WL1835MOD WiLink™ 8 Single-Band-Kombimodul 2x2 MIMO Wi-Fi ®, Bluetooth® und Bluetooth Smart-Modul WL1837MOD Industrielles Dual-Band-Modul für WiLink™ 8 mit 2x2 MIMO Wi-Fi®, Bluetooth® /Bluetooth Smart-Modul
Download-Optionen
Treiber oder Bibliothek

WL18XX-BT-SP — Bluetooth-Servicepack für WL18xx

The Bluetooth Service Pack is composed of the following four files:

  • BTS file (TIInit_11.8.32.bts)
  • ILI file (TIInit_11.8.32.ili)
  • XML (TIInit_11.8.32.xml)
  • Release Notes Document
  • License Agreement

Note the version in the file name is unique for combination of hardware and firmware, but is not (...)

Benutzerhandbuch: PDF
Support-Software

CLRNX-3P-CLARIFI — Clarinox ClariFi Integrierter Drahtlos-Debugger

ClariFi™ bietet eine integrierte Protokollanalysator-Unterstützung für ein schnelleres Debugging komplexer Drahtlosgeräte und wird mit unserer benutzerfreundlichen SoftFrame Abstraction Layer-Middleware verwendet. Es bietet Threading, Speicherauslastung und Speicherleckanalyse. Zusammen (...)
Von: Clarinox
Support-Software

CLRNX-3P-CLARINOX-BLUE — ClarinoxBlue Integrierter Bluetooth® Protocol Stack

Der ClarinoxBlue™ Protocol Stack wurde von Embedded-Entwicklern für Embedded-Entwickler entwickelt. Dank des einfachen und flexiblen Ansatzes des ClarinoxBlue-Protokollstacks können Sie mehr Zeit in die Entwicklung Ihrer Anwendungen investieren. Sie müssen sich nicht mehr mit den Einzelheiten der (...)
Von: Clarinox
Support-Software

CLRNX-3P-CLARINOX-WIFI — ClarinoxWiFi Integrierter WLAN-Protokollstack

ClarinoxWiFi ist ein bewährter WLAN-Protokollstack mit AP-, STA-, P2P- und Mesh-Rollen, der eine große Bandbreite verschiedener RTOS/MCUs unterstützt. Mit ClarinoxWiFi können Entwickler zuverlässige und leistungsfähige WLAN-Verbindungen für eine Vielzahl von drahtlosen Embedded-Anwendungen (...)
Von: Clarinox
Zertifizierung

WL18XX-CERTIFICATION — Funkzertifizierung für WiLink™ 8

Benötigen Sie Unterstützung bei der Zertifizierung des WiLink™ 8-Moduls? WL18XX-CERTIFICATION bietet die relevanten Informationen und die gezielte Unterstützung für eine erfolgreiche Zertifizierung Ihres Produkts. Auf dieser Seite finden Sie die neuesten Zertifizierungsberichte unserer (...)
Zertifizierung

WL18XX-REPORTS Reports: WL18XX Regulatory Certification Reports

Are you looking for WiLink™ 8 module certification support? WL18XX-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
WLAN-Produkte
WL1801MOD WiLink™ 8-Einzelband-Wi-Fi®-Modul WL1805MOD WiLink™ 8 Single-Band, 2x2 MIMO Wi-Fi®-Modul WL1807MOD WiLink™ 8 industrielles Dual-Band-Kombimodul, 2 x 2 MIMO Wi-Fi-Modul WL1831MOD WiLink™ 8 Industrial Wi-Fi, Bluetooth und Bluetooth Smart (Low Energy)-Modul WL1835MOD WiLink™ 8 Single-Band-Kombimodul 2x2 MIMO Wi-Fi ®, Bluetooth® und Bluetooth Smart-Modul WL1837MOD Industrielles Dual-Band-Modul für WiLink™ 8 mit 2x2 MIMO Wi-Fi®, Bluetooth® /Bluetooth Smart-Modul
Hardware-Entwicklung
Tochterkarte
WL1835MODCOM8B WiLink™ 8 Modul, 2,4 GHz, WiFi® + Bluetooth® COM8 – Evaluierungsmodul WL1837MODCOM8I WiLink™ 8-Evaluierungsmodul mit Dualbandunterstützung (2,4 und 5 GHz) für Wi-Fi® und Bluetooth® COM8
Download-Optionen
Designtool

WILINK-DESIGN-REVIEWS — Hardware-Design-Prüfungen für WL18xx-Bausteine

To get started with the WiLink™ hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see WL18xx product page links below).
  • Step 2: Download and (...)
Benutzerhandbuch: PDF | HTML
Referenzdesigns

TIDC-WL1837MOD-AUDIO-MULTIROOM-CAPE — TI WiLink™8 Wi-Fi®/Bluetooth®/Bluetooth-Audio Multi-Room-Cape-Referenzdesign mit geringem Stromverbr

The TI WiLink™ 8 WL1837MOD audio cape is a wireless multi-room audio reference design used with BeagleBone Black (featuring TI Sitara™ AM335x). The WiLink 8 device's WLAN capability to capture and register precise arrival time of the connected AP's beacon is used to achieve ultra-precise (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDC-WL1835MODCOM8B — 2,4 GHz WiFi® + Bluetooth® Zertifiziertes Antennendesign auf WiLink™ 1835-Modul

The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way it's been certified. Through this, customers are able to evaluate the performance of the module through (...)
Schaltplan: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
QFM (MOC) 100 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos