Detalles del producto

DSP type 1 C4x DSP (max) (MHz) 60 CPU 32-bit Rating Military Operating temperature range (°C) -55 to 125
DSP type 1 C4x DSP (max) (MHz) 60 CPU 32-bit Rating Military Operating temperature range (°C) -55 to 125
CFP (HFH) 352 2304 mm² 48 x 48 CPGA (GF) 325 2232.5625 mm² 47.25 x 47.25
  • SMJ: QML Processing to MIL-PRF-38535
  • SM: Standard Processing
  • TMP: Commercial Level Processing TAB
  • Operating Temperature Ranges:
    • Military (M) -55°C to 125°C
    • Special (S) -55°C to 100°C
    • Commercial (C) -25°C to 85°C
    • Commercial (L) 0°C to 70°C
  • Highest Performance Floating-Point Digital Signal Processor (DSP)
    • C40-60:
      • 33-ns Instruction Cycle Time:
        60 MFLOPS, 30 MIPS, 330 MOPS, 384 MBps
    • C40-50:
      • 40-ns Instruction Cycle Time:
        50 MFLOPS, 25 MIPS, 275 MOPS, 320 MBps
    • C40-40:
      • 50-ns Instruction Cycle Time:
        40 MFLOPS, 20 MIPS, 220 MOPS, 256 MBps
  • Six Communications Ports
  • 6-Channel Direct Memory Access (DMA) Coprocessor
  • Single-Cycle Conversion to and From IEEE-745 Floating-Point Format
  • Single Cycle 1/x, 1/x
  • Source-Code Compatible With SMJ320C30
  • Validated Ada Compiler
  • Single-Cycle 40-Bit Floating-Point, 32-Bit Integer Multipliers
  • 12 40-Bit Registers, 8 Auxiliary Registers, 14 Control Registers, and 2 Timers
  • IEEE Standard 1149.1 Test-Access Port (JTAG)
  • Two Identical External Data and Address Buses Supporting Shared Memory Systems and High Data-Rate, Single-Cycle Transfers:
    • High Port-Data Rate of 100 MBytes/s (Each Bus)
    • 16G-Byte Continuous Program/Data/Peripheral Address Space
    • Memory-Access Request for Fast, Intelligent Bus Arbitration
    • Separate Address-, Data-, and Control-Enable Pins
    • Four Sets of Memory-Control Signals Support Different Speed Memories in Hardware
  • Packaging:
    • 325-Pin Ceramic Grid Array (GF Suffix)
    • 352-Lead Ceramic Quad Flatpack (HFH Suffix)
    • 324-Pad JEDEC-Standard TAB Frame
  • Fabricated Using Enhanced Performance Implanted CMOS (EPIC™) Technology by Texas Instruments (TI™)
  • Separate Internal Program, Data, and DMA Coprocessor Buses for Support of Massive Concurrent Input/Output (I/O) of Program and Data Throughput, Maximizing Sustained Central Processing Unit (CPU) Performance
  • On-Chip Program Cache and Dual-Access/Single-Cycle RAM for Increased Memory-Access Performance
    • 512-Byte Instruction Cache
    • 8K Bytes of Single-Cycle Dual-Access Program or Data RAM
    • ROM-Based Bootloader Supports Program Bootup Using 8-, 16-, or 32-Bit Memories Over Any One of the Communications Ports

IEEE Standard 1149.1- 1990, IEEE Standard Test-Access Port and Boundary-Scan Architecture.
EPIC and TI are trademarks of Texas Instruments Incorporated.

  • SMJ: QML Processing to MIL-PRF-38535
  • SM: Standard Processing
  • TMP: Commercial Level Processing TAB
  • Operating Temperature Ranges:
    • Military (M) -55°C to 125°C
    • Special (S) -55°C to 100°C
    • Commercial (C) -25°C to 85°C
    • Commercial (L) 0°C to 70°C
  • Highest Performance Floating-Point Digital Signal Processor (DSP)
    • C40-60:
      • 33-ns Instruction Cycle Time:
        60 MFLOPS, 30 MIPS, 330 MOPS, 384 MBps
    • C40-50:
      • 40-ns Instruction Cycle Time:
        50 MFLOPS, 25 MIPS, 275 MOPS, 320 MBps
    • C40-40:
      • 50-ns Instruction Cycle Time:
        40 MFLOPS, 20 MIPS, 220 MOPS, 256 MBps
  • Six Communications Ports
  • 6-Channel Direct Memory Access (DMA) Coprocessor
  • Single-Cycle Conversion to and From IEEE-745 Floating-Point Format
  • Single Cycle 1/x, 1/x
  • Source-Code Compatible With SMJ320C30
  • Validated Ada Compiler
  • Single-Cycle 40-Bit Floating-Point, 32-Bit Integer Multipliers
  • 12 40-Bit Registers, 8 Auxiliary Registers, 14 Control Registers, and 2 Timers
  • IEEE Standard 1149.1 Test-Access Port (JTAG)
  • Two Identical External Data and Address Buses Supporting Shared Memory Systems and High Data-Rate, Single-Cycle Transfers:
    • High Port-Data Rate of 100 MBytes/s (Each Bus)
    • 16G-Byte Continuous Program/Data/Peripheral Address Space
    • Memory-Access Request for Fast, Intelligent Bus Arbitration
    • Separate Address-, Data-, and Control-Enable Pins
    • Four Sets of Memory-Control Signals Support Different Speed Memories in Hardware
  • Packaging:
    • 325-Pin Ceramic Grid Array (GF Suffix)
    • 352-Lead Ceramic Quad Flatpack (HFH Suffix)
    • 324-Pad JEDEC-Standard TAB Frame
  • Fabricated Using Enhanced Performance Implanted CMOS (EPIC™) Technology by Texas Instruments (TI™)
  • Separate Internal Program, Data, and DMA Coprocessor Buses for Support of Massive Concurrent Input/Output (I/O) of Program and Data Throughput, Maximizing Sustained Central Processing Unit (CPU) Performance
  • On-Chip Program Cache and Dual-Access/Single-Cycle RAM for Increased Memory-Access Performance
    • 512-Byte Instruction Cache
    • 8K Bytes of Single-Cycle Dual-Access Program or Data RAM
    • ROM-Based Bootloader Supports Program Bootup Using 8-, 16-, or 32-Bit Memories Over Any One of the Communications Ports

IEEE Standard 1149.1- 1990, IEEE Standard Test-Access Port and Boundary-Scan Architecture.
EPIC and TI are trademarks of Texas Instruments Incorporated.

The C40 digital signal processors (DSPs) are 32-bit, floating-point processors manufactured in 0.72-um, double-level metal CMOS technology. The 320C40 is a part of the fourth-generation DSPs from Texas Instruments and is designed primarily for parallel processing.

For additional information when designing for cold temperature operation, please see Texas Instruments application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature number SGUA001.

The C40 digital signal processors (DSPs) are 32-bit, floating-point processors manufactured in 0.72-um, double-level metal CMOS technology. The 320C40 is a part of the fourth-generation DSPs from Texas Instruments and is designed primarily for parallel processing.

For additional information when designing for cold temperature operation, please see Texas Instruments application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature number SGUA001.

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Documentación técnica

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Tipo Título Fecha
* Data sheet SMJ320C40, TMP320C40 Digital Signal Processors datasheet (Rev. H) 12 oct 2001
* SMD SMJ320C40 SMD 5962-94669 21 jun 2016
Application note 320C3x, 320C4x, and 320MCM42x Power-Up Sensitivity at Cold Temperatures (Rev. D) 06 ago 2004
More literature SMJ320C40 DSP (Rev. H) 03 abr 2001
User guide JTAG/MPSD Emulation Technical Reference (Rev. A) 01 dic 1994
Application note Setting Up TMS320 DSP Interrupts in 'C' 01 nov 1994
User guide TMS320C4x Parallel Processing Development System Technical Reference (Rev. A) 08 abr 1994
Application note Parallel 2-D FFT Implementation With TMS320C4x DSPs (Rev. A) 01 feb 1994
Application note Parallel Digital Signal Processing With the TMS320C40 01 feb 1994
Application note Parallel Processing With TMS320C4x 01 feb 1994
Application note Calculation of TMS320C40 Power Dissipation 01 nov 1993
User guide Parallel Debug Mgr Addendum to TMS320C4x & TMS320C5x C Source Debugger UGs 01 abr 1993

Diseño y desarrollo

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Modelo de simulación

TI320C40_hfh BSDL Model

SGUM002.ZIP (7 KB) - BSDL Model
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
CFP (HFH) 352 Ultra Librarian
CPGA (GF) 325 Ultra Librarian

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  • Acabado de plomo/material de la bola
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  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
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