TPA321

ACTIVO

Amplificador de audio mono de Clase AB, entrada analógica y 700 mW

Detalles del producto

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.35 THD + N at 1 kHz (%) 1 Iq (typ) (mA) 0.7 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
  • Ultralow Supply Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
  • Ultralow Supply Current in Shutdown Mode...0.15 µA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

The TPA321 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA321 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA321 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD™ MSOP, which reduces board space by 50% and height by 40%.

The TPA321 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA321 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The TPA321 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD™ MSOP, which reduces board space by 50% and height by 40%.

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Documentación técnica

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* Data sheet TPA321: 350-mW Mono Audio Power Amplifier with Differential Inputs datasheet (Rev. C) 23 jun 2004

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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