TPA701

ACTIVO

Amplificador de audio mono de Clase AB, entrada analógica y 700 mW, con corriente quiescente de 1.5 

Detalles del producto

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultralow Quiescent Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 3.3 V, BTL
  • Ultralow Quiescent Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 700-mW Low-Voltage Audio Power Amplifier datasheet (Rev. D) 01 may 2003
Application note PowerPAD™ Thermally Enhanced Package (Rev. H) 06 jul 2018
User guide TPA701MSOPEVM - User Guide (Rev. B) 17 abr 2001

Diseño y desarrollo

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Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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