TPA711

ACTIVO

Amplificador de audio mono de Clase AB, entrada analógica y 700 mW, con control de modo BTL a SE

Detalles del producto

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 0.7 THD + N at 1 kHz (%) 0.5 Iq (typ) (mA) 1.25 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 85 Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power
    • 700 mW at VDD = 5 V, BTL, RL = 8
    • 85 mW at VDD = 5 V, SE, RL = 32
    • 250 mW at VDD = 3.3 V, BTL, RL = 8
    • 37 mW at VDD = 3.3 V, SE, RL = 32
  • Shutdown Control
    • IDD = 7 uA at 3.3 V
    • IDD = 50 uA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power
    • 700 mW at VDD = 5 V, BTL, RL = 8
    • 85 mW at VDD = 5 V, SE, RL = 32
    • 250 mW at VDD = 3.3 V, BTL, RL = 8
    • 37 mW at VDD = 3.3 V, SE, RL = 32
  • Shutdown Control
    • IDD = 7 uA at 3.3 V
    • IDD = 50 uA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

The TPA711 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which reduces board space by 50% and height by 40%.

The TPA711 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA711 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA711 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to eliminate speaker noise when exiting shutdown mode. The TPA711 is available in an 8-pin SOIC and the surface-mount PowerPAD MSOP package, which reduces board space by 50% and height by 40%.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 700-mW Mono Low-Voltage Audio Power Amplifier datasheet (Rev. D) 18 oct 2002
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 26 ago 2019
Application note PowerPAD™ Thermally Enhanced Package (Rev. H) 06 jul 2018
EVM User's guide TPA711MSOPEVM - User Guide (Rev. B) 17 abr 2001

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TPA711MSOPEVM — Módulo de evaluación (EVM) TPA711MSOP

A 700-mW mono amplifier that will operate in both bridge-tied load (BTL) and single-ended (SE) modes. This makes the TPA711 ideal for applications that require a mono earphone and speaker. In addition, integrated DEPOP circuitry eliminates speaker noise when the amplifier turns on, off, or exits (...)

Guía del usuario: PDF
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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