CD4014B
- Medium speed operation…12 MHz (typ.) clock rate at VDD – VSS = 10 V
- Fully static operation
- 8 master-slave flip-flops plus output buffering and control gating
- 100% tested for quiescent current at 20 V
- Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
- Noise margin (full package-temperature range) =
1 V at VDD = 5 V
2 V at VDD = 10 V
2.5 V at VDD = 15 V - Standardized, symmetrical output characteristics
- 5-V, 10-V, and 15-V parametric ratings
- Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
- Applications:
- Parallel input/serial output data queueing
- Parallel to serial data conversion
- General-purpose register
Data sheet acquired from Harris Semiconductor
CD4014B and CD4021B series types are 8-stage parallel- or serial-input/serial output registers having common CLOCK and PARALLEL/SERIAL CONTROL inputs, a single SERIAL data input, and individual parallel "JAM" inputs to each register stage. Each register stage is D-type, master-slave flip-flop. In addition to an output form stage 8, "Q" outputs are also available from stages 6 and 7. Parallel as well as serial entry is made into the register synchronously with the positive clock line transition in the CD4014B. In the CD4021B serial entry is synchronous with the clock by parallel entry is asynchronous. In both types, entry is controlled by the PARALLEL/SERIAL CONTROL input. When the PARALLEL/SERIAL CONTROL input is low, data is serially shifted into the 8-stage register synchronously with the positive transition of the clock line. When the PARALLEL/SERIAL CONTROL input is high, data is jammed into the 8-stage register via the parallel input lines and synchronous with the positive transition of the clock line. In the CD4021B, the CLOCK input of the internal stage is "forced" when asynchronous parallel entry is made. Register expansion using multiple packages is permitted.
The CD4014B and CD4021B series types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-oultine packages (PW and PWR suffixes).
技術資料
設計および開発
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14-24-LOGIC-EVM — 14 ピンから 24 ピンの D、DB、DGV、DW、DYY、NS、PW の各パッケージに封止した各種ロジック製品向けの汎用評価基板
14-24-LOGIC-EVM 評価基板 (EVM) は、14 ピンから 24 ピンの D、DW、DB、NS、PW、DYY、DGV の各パッケージに封止した各種ロジック デバイスをサポートする設計を採用しています。
パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
---|---|---|
PDIP (N) | 16 | Ultra Librarian |
SOIC (D) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
購入と品質
- RoHS
- REACH
- デバイスのマーキング
- リード端子の仕上げ / ボールの原材料
- MSL 定格 / ピーク リフロー
- MTBF/FIT 推定値
- 使用原材料
- 認定試験結果
- 継続的な信頼性モニタ試験結果
- ファブの拠点
- 組み立てを実施した拠点