제품 상세 정보

Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family AC Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 3 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -24 Input type CMOS Output type CMOS Features Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode Technology family AC Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35
  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-um Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic Thin Shrink Small-Outline (DGG) Package, 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings

    EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
  • Flow-Through Architecture Optimizes PCB Layout
  • Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
  • EPIC TM (Enhanced-Performance Implanted CMOS) 1-um Process
  • 500-mA Typical Latch-Up Immunity at 125°C
  • Package Options Include Plastic Thin Shrink Small-Outline (DGG) Package, 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings

    EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AC16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements

These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction control (DIR) input. The output-enable input (OE\) can be used to disable the devices so that the buses are effectively isolated.

The 74AC16245 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16245 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16245 is characterized for operation from -40°C to 85°C.

The 'AC16245 are 16-bit bus transceivers organized as dual-octal noninverting 3-state transceivers designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements

These devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending upon the logic level at the direction control (DIR) input. The output-enable input (OE\) can be used to disable the devices so that the buses are effectively isolated.

The 74AC16245 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area.

The 54AC16245 is characterized for operation over the full military temperature range of -55°C to 125°C. The 74AC16245 is characterized for operation from -40°C to 85°C.

다운로드

관심 가지실만한 유사 제품

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
SN74LVC16245A 활성 3상 출력을 지원하는 16비트 버스 트랜시버 Smaller voltage range (1.65V to 3.6V), shorter propagation delay (5.5ns)

기술 자료

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* Data sheet 16-Bit Bus Transceivers With 3-State Outputs datasheet (Rev. A) 1996/04/01

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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