패키징 정보
| 패키지 | 핀 TSSOP (DBT) | 44 |
| 작동 온도 범위(°C) -40 to 85 |
| 패키지 수량 | 캐리어 40 | TUBE |
BQ76940의 주요 특징
- AFE monitoring features
- Pure digital interface
- Internal ADC measures cell voltage, die temperature, and external thermistor
- A separate, internal ADC measures pack current (coulomb counter)
- Directly supports up to three thermistors (103AT)
- Hardware protection features
- Overcurrent in Discharge (OCD)
- Short Circuit in Discharge (SCD)
- Overvoltage (OV)
- Undervoltage (UV)
- Secondary protector fault detection
- Additional features
- Integrated cell balancing FETs
- Charge, discharge low-side NCH FET drivers
- Alert interrupt to host microcontroller
- 2.5-V or 3.3-V output voltage regulator
- No EEPROM programming necessary
- High supply voltage absolute maximum (up to 108 V)
- Simple I2C compatible interface (CRC option)
- Random cell connection tolerant
BQ76940에 대한 설명
The BQ769x0 family of robust analog front-end (AFE) devices serves as part of a complete pack monitoring and protection solution for next-generation, high-power systems, such as light electric vehicles, power tools, and uninterruptible power supplies. The BQ769x0 is designed with low power in mind: Sub-blocks within the IC may be enabled or disabled to control the overall chip current consumption, and a SHIP mode provides a simple way to put the pack into an ultra-low power state.
The BQ76920 device supports up to 5-series cells or typical 18-V packs, the BQ76930 handles up to 10-series cells or typical 36-V packs, and the BQ76940 works for up to 15-series cells or typical 48-V packs. A variety of battery chemistries may be managed with these AFEs, including Li-ion, Li-iron phosphate, and more. Through I2C, a host controller can use the BQ769x0 to implement many battery pack management functions, such as monitoring (cell voltages, pack current, pack temperatures), protection (controlling charge/discharge FETs), and balancing. Integrated A/D converters enable a purely digital readout of critical system parameters, with calibration handled in TI’s manufacturing process.