CY54FCT543T
- Function, Pinout, and Drive Compatible With FCT and F Logic
- Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- 3-State Outputs
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Separation Controls for Data Flow in Each Direction
- Back-to-Back Latches for Storage
- CY54FCT543T
- 48-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT543T
- 64-mA Output Sink Current
- 32-mA Output Source Current
The \x92FCT543T octal latched transceivers contain two sets of eight D-type latches with separate latch-enable (LEAB\, LEBA\) and output-enable (OEAB\, OEBA\) inputs for each set to permit independent control of input and output in either direction of data flow. For data flow from A to B, for example, the A-to-B enable (CEAB\) input must be low in order to enter data from A or to take data from B, as indicated in the function table. With CEAB\ low, a low signal on the A-to-B latch-enable (LEAB\) input makes the A-to-B latches transparent; a subsequent low-to-high transition of the LEAB\ signal puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB\ and OEAB\ low, the 3-state B-output buffers are active and reflect the data present at the output of the A latches. Control of data from B to A is similar, but uses CEBA\, LEBA\, and OEBA\ inputs.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 8-Bit Latched Registered Transceivers With 3-State Outputs datasheet (Rev. A) | 2001/10/01 | |
* | SMD | CY54FCT543T SMD 5962-92221 | 2016/06/21 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
User guide | CYFCT Parameter Measurement Information | 2001/04/02 | ||
Selection guide | Advanced Bus Interface Logic Selection Guide | 2001/01/09 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (JT) | 24 | Ultra Librarian |
LCCC (FK) | 28 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치