CY54FCT646T
- Function, Pinout, and Drive Compatible With FCT and F Logic
- Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Independent Register for A and B Buses
- CY54FCT646T
- 48-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT646T
- 64-mA Output Sink Current
- 32-mA Output Source Current
- 3-State Outputs
The \x92FCT646T devices consist of a bus transceiver circuit with 3-state, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus is clocked into the registers as the appropriate clock pin goes to a high logic level. Output-enable (G\) and direction (DIR) inputs control the transceiver function. In the transceiver mode,data present at the high-impedance port can be stored in either the A or B register, or in both. Select controls (SAB, SBA) can multiplex stored and real-time (transparent mode) data. DIR determines which bus receives data when G\ is low. In the isolation mode (G\ is high), A data can be stored in the B register and/or B data can be stored in the A register.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 8-Bit Registered Transceivers With 3-State Outputs datasheet (Rev. A) | 2001/10/01 | |
* | SMD | CY54FCT646T SMD 5962-92223 | 2016/06/21 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
User guide | CYFCT Parameter Measurement Information | 2001/04/02 | ||
Selection guide | Advanced Bus Interface Logic Selection Guide | 2001/01/09 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (JT) | 24 | Ultra Librarian |
LCCC (FK) | 28 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치