홈 로직 및 전압 변환 버퍼, 드라이버 및 트랜시버 인버팅 버퍼 및 드라이버
홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
인버팅 버퍼 및 드라이버

SN54ABT16240A

활성

TTL 호환 CMOS 입력 및 3상 출력을 지원하는 군사용 16채널, 4.5V~5.5V 인버터

지금 주문
데이터 시트

SN54ABT16240A

활성
데이터 시트 지금 주문

제품 상세 정보

Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 34 Input type TTL-Compatible CMOS Output type 3-State Features Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 34 Input type TTL-Compatible CMOS Output type 3-State Features Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Military Operating temperature range (°C) -55 to 125
CFP (WD) 48 153.4008 mm² 15.88 x 9.66
  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Latch-Up Performance Exceeds 500 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

    • Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • High-Drive Outputs (-32-mA IOH, 64-mA IOL)
  • Latch-Up Performance Exceeds 500 mA
    Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

    • Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.

The 'ABT16240A devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide inverting outputs and symmetrical active-low output-enable (OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16240A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16240A is characterized for operation from -40°C to 85°C.

The 'ABT16240A devices are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide inverting outputs and symmetrical active-low output-enable (OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT16240A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16240A is characterized for operation from -40°C to 85°C.

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기술 자료

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유형 직함 날짜
* Data sheet 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. G) 1998/10/28
* SMD SN54ABT16240A SMD 5962-93199 2016/06/21
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 2004/02/16
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997/03/01
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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