홈 로직 및 전압 변환 버퍼, 드라이버 및 트랜시버 범용 트랜시버
홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
범용 트랜시버

SN54ABT2952A

활성

3상 출력을 지원하는 8진 버스 트랜시버 및 레지스터

지금 주문
데이터 시트

SN54ABT2952A

활성
데이터 시트 지금 주문

제품 상세 정보

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 48 IOH (max) (mA) -24 Input type TTL Output type TTL Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 48 IOH (max) (mA) -24 Input type TTL Output type TTL Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Military Operating temperature range (°C) -55 to 125
CDIP (JT) 24 221.44 mm² 32 x 6.92
  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Two 8-Bit Back-to-Back Registers Store Data Flowing in Both Directions
  • Noninverting Outputs
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (NT) and Ceramic (JT) DIPs

EPIC is a trademark of Texas Instruments Incorporated.

  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Two 8-Bit Back-to-Back Registers Store Data Flowing in Both Directions
  • Noninverting Outputs
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (NT) and Ceramic (JT) DIPs

EPIC is a trademark of Texas Instruments Incorporated.

The 'ABT2952A transceivers consist of two 8-bit back-to-back registers that store data flowing in both directions between two bidirectional buses. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input provided that the clock-enable (CLKENAB\ or CLKENBA\) input is low. Taking the output-enable (OEAB\ or OEBA\) input low accesses the data on either port.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT2952A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2952A is characterized for operation from -40°C to 85°C.

The 'ABT2952A transceivers consist of two 8-bit back-to-back registers that store data flowing in both directions between two bidirectional buses. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input provided that the clock-enable (CLKENAB\ or CLKENBA\) input is low. Taking the output-enable (OEAB\ or OEBA\) input low accesses the data on either port.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT2952A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2952A is characterized for operation from -40°C to 85°C.
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기술 자료

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20개 모두 보기
유형 직함 날짜
* Data sheet Octal Bus Transceivers And Registers With 3-State Outputs datasheet (Rev. D) 1998/01/01
* SMD SN54ABT2952A SMD 5962-93086 2016/06/21
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 2004/02/16
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 1997/03/01
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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CDIP (JT) 24 Ultra Librarian
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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