SN54BCT543
- State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
- 3-State True Outputs
- Back-to-Back Registers for Storage
- ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015
- Package Options Include Plastic Small-Outline Packages (DW), Ceramic Chip Carriers (FK) and Flatpacks (W), and Plastic and Ceramic 300-mil DIPs (JT, NT)
The 'BCT543 octal transceiver contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (LEAB\ or LEBA\) and output-enable (OEAB\ or OEBA\) inputs are provided for each register to permit independent control in either direction of data flow.
The A-to-B enable (CEAB\) input must be low in order to enter data from A or to output data from B. If CEAB\ is low and LEAB\ is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB\ puts the A latches in the storage mode. With CEAB\ and OEAB\ both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar but requires using the CEBA\, LEBA\, and OEBA\ inputs.
The SN54BCT543 is characterized for operation over the full military temperature range of \x9655°C to 125°C. The SN74BCT543 is characterized for operation from 0°C to 70°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Octal Registered Transceivers With 3-State Outputs datasheet (Rev. C) | 1994/04/01 | |
* | SMD | SN54BCT543 SMD 5962-90870 | 2016/06/21 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997/08/01 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
Application note | Live Insertion | 1996/10/01 |
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (JT) | 24 | Ultra Librarian |
LCCC (FK) | 28 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치