SN54BCT640
- State-of-the-Art BiCMOS Design Substantially Reduces Standby Current
- Outputs Have Undershoot-Protection Circuitry
- Power-Up High-Impedance State
- Buffered Control Inputs to Reduce DC Loading Effects
- ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015
- Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Plastic and Ceramic 300-mil DIPs (J, N)
The ´BCT640 bus transceiver is designed for asynchronous communication between data buses. These devices transmit data from the A bus to the B bus or from the B bus to the A bus depending upon the level at the direction-control (DIR) input. The output-enable () input can be used to disable the device so that the buses are effectively isolated.
The SN54BCT640 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT640 is characterized for operation from 0°C to 70°C.
기술 자료
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
12개 모두 보기 유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Octal Bus Transceivers With 3-State Outputs datasheet (Rev. C) | 1994/04/01 | |
* | SMD | SN54BCT640 SMD 5962-90752 | 2016/06/21 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997/08/01 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 20 | Ultra Librarian |
CFP (W) | 20 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치