데이터 시트
SN54BCT760
- Open-Collector Version of ´BCT244
- Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers
- ESD Protection Exceeds 2000 V Per MIL-STD-883C Method 3015
- Packages Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (J, N)
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The ´BCT760 is organized as two 4-bit buffers/line drivers
with separate output-enable (
) inputs. When is
low, the device passes data from the A inputs to the Y outputs. When
is high, the
outputs are in the high-impedance state.
The SN54BCT760 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT760 is characterized for operation from 0°C to 70°C.
기술 자료
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12개 모두 보기 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Octal Buffers/Drivers With Open-Collector Outputs datasheet (Rev. B) | 1993/11/01 | |
| * | SMD | SN54BCT760 SMD 5962-90938 | 2016/06/21 | |
| Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997/08/01 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CDIP (J) | 20 | Ultra Librarian |
| CFP (W) | 20 | Ultra Librarian |
| LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치