데이터 시트
SN54F241
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Package Options Include Plastic Small-Outline Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
These octal buffers and line drivers are designed specifically to
improve both the performance and density of 3-state memory address
drivers, clock drivers, and bus-oriented receivers and transmitters.
Taken together with the ´F240 and ´F244, these devices
provide the choice of selected combinations of inverting and non
inverting outputs, symmetrical 
(active-low output-enable) inputs, and complementary OE
and inputs.
The SN54F241 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F241 is characterized for operation from 0°C to 70°C.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 자료
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
10개 모두 보기 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Octal Buffers/Drivers With 3-State Outputs datasheet | 1993/10/01 | |
| * | SMD | SN54F241 SMD 5962-86874 | 2016/06/21 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997/08/01 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CDIP (J) | 20 | Ultra Librarian |
| CFP (W) | 20 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치