데이터 시트
SN54LS241
- Inputs Tolerant Down to 2 V, Compatible With 3.3-V or 2.5-V Logic Inputs
- Maximum tpd of 15 ns at 5 V
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- PNP Inputs Reduce DC Loading
- Hysteresis at Inputs Improves Noise Margins
The SNx4LS24x, SNx4S24x octal buffers and line drivers are designed specifically to improve both the performance and density of three-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The designer has a choice of selected combinations of inverting and non-inverting outputs, symmetrical, active-low output-control (G) inputs, and complementary output-control (G and G) inputs. These devices feature high fan-out, improved fan-in, and 400-mV noise margin. The SN74LS24x and SN74S24x devices can be used to drive terminated lines down to 133 Ω.
기술 자료
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10개 모두 보기 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | SNx4LS24x, SNx4S24x Octal Buffers and Line Drivers With 3-State Outputs datasheet (Rev. D) | PDF | HTML | 2016/10/10 |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CDIP (J) | 20 | Ultra Librarian |
| CFP (W) | 20 | Ultra Librarian |
| LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치