SN54LS365A
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Choice of True or Inverting Outputs
- Package Options Include Plastic “Small Outline" Packages, Ceramic Chip Carriers and Flat Packages, and Plastic and Ceramic DIPs
- Dependable Texas Instruments Quality and Reliability
- '365A, '367A, 'LS365A, 'LS367A True Outputs '366A, '368A, 'LS366A, 'LS368A Inverting Outputs
These Hex buffers and line drivers are designed specifically to improve both the performance and density of three-state memory address drivers, clock drivers, and bus oriented receivers and transmitters. The designer has choice of selected combinations of inverting and noninverting outputs, symmetrical G\ (active-low control) inputs.
These devices feature high fan-out, improved fan-in, and can be used to drive terminated lines down to 133 ohms.
The SN54365A thru SN54368A and SN54LS365A thru SN54LS368A are characterized for operation over the full military temperature range of -55°C to 125°C. The SN74365A thru SN74368A and SN74LS365A thru SN74LS368A are characterized for operation from 0°C to 70°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Hex Bus Drivers With 3-State Outputs datasheet | 1988/03/01 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CDIP (J) | 16 | Ultra Librarian |
| LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치