SN54LS640
- SN74LS64X-1 Versions Rated at IOL of 48 mA
- Bi-directional Bus Transceivers in High-Density 20-Pin Packages
- Hysteresis at Bus Inputs Improves Noise Margins
- Choice of True or Inverting Logic
- Choice of 3-State or Open-collector Outputs
These octal bus transceivers are designed for asynchronous two-way communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus depending upon the level at the direction control (DIR) input. The enable input (G) can be used to disable the device so the buses are effectively isolated.
The -1 versions of the SN74LS640 thru SN74LS642, SN74LS644, and SN74LS645 are identical to the standard versions except that the recommended maximum IOL is increased to 48 milliamperes. There are no -1 versions of the SN54LS640 thru SN54LS642, SN54LS644, and SN54LS645.
The SN54LS640 thru SN54LS642, SN54LS644, and SN54LS645 are characterized for operation over the full military tempearture range of –55°C to 125°C. The SN74LS640 thru SN74LS642, SN74LS644, and SN74LS645 are characterized for operation from 0°C to 70°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | SN54LS64x, SN74LS64x Octal Bus Transceivers datasheet (Rev. A) | 1979/04/01 | |
| * | SMD | SN54LS640 SMD 84161012A | 2016/06/21 | |
| Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
| Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
| Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
| Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
| Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| CDIP (J) | 20 | Ultra Librarian |
| LCCC (FK) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치