데이터 시트
SN74ACT04-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree
- 4.5-V to 5.5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 8.5 ns at 5 V
- Inputs Are TTL-Voltage Compatible
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
The SN74ACT04 contains six independent inverters. The device performs the Boolean function Y = A\.
기술 자료
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
12개 모두 보기 유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | SN74ACT04-EP datasheet | 2004/09/28 | |
* | VID | SN74ACT04-EP VID V6204758 | 2016/06/21 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997/06/01 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996/04/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치