SN74ACT1071
- Designed to Ensure Defined Voltage Levels on Floating Bus Lines in CMOS Systems
- Reduces Undershoot and Overshoot Caused By Line Reflections
- Repetitive Peak Forward Current . . . IFRM = 100 mA
- Inputs Are TTL-Voltage Compatible
- Low Power Consumption (Like CMOS)
- ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise
This device is designed to terminate bus lines in CMOS systems. The integrated low-impedance diodes clamp the voltage of undershoots and overshoots caused by line reflections and ensure signal integrity. The device also contains a bus-hold function that consists of a CMOS-buffer stage with a high-resistance feedback path between its output and its input. The SN74ACT1071 prevents bus lines from floating without using pullup or pulldown resistors.
The high-impedance inputs of these internal buffers are connected to the input terminals of the device. The feedback path on each internal buffer stage keeps a bus line tied to the bus holder at the last valid logic state generated by an active driver before the bus switches to the high-impedance state.
The SN74ACT1071 is characterized for operation from -40°C to 85°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 10-Bit Bus-Termination Array With Bus-Hold Function datasheet | 1993/04/01 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021/07/26 | ||
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997/06/01 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996/04/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치