SN74ALVCF162834

활성

3상 출력을 지원하는 3.3V CMOS 18비트 범용 버스 드라이버

alarm알림 지금 주문

제품 상세 정보

Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 18 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 18 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35
  • Member of the Texas Instruments Widebus™ Family
  • Ideal for Use in PC133 Register DIMM
  • Typical Output Skew . . . <250 ps
  • VCC = 3.3 V ± 0.3 V . . . Normal Range
  • VCC = 2.7 V to 3.6 V . . . Extended Range
  • VCC = 2.5 V ± 0.2 V
  • Rail-to-Rail Output Swing for Increased Noise Margin
  • Balanced Output Drivers . . . ±18 mA
  • Low Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Widebus is a trademark of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • Ideal for Use in PC133 Register DIMM
  • Typical Output Skew . . . <250 ps
  • VCC = 3.3 V ± 0.3 V . . . Normal Range
  • VCC = 2.7 V to 3.6 V . . . Extended Range
  • VCC = 2.5 V ± 0.2 V
  • Rail-to-Rail Output Swing for Increased Noise Margin
  • Balanced Output Drivers . . . ±18 mA
  • Low Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Widebus is a trademark of Texas Instruments.

This 18-bit universal bus driver is designed for 2.3-V to 3.6-V VCC operation.

Data flow from A to Y is controlled by the output-enable (OE)\ input. The device operates in the transparent mode when the latch-enable (LE)\ input is low. When LE\ is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE\ is high, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE\ is high, the outputs are in the high-impedance state.

The ALVCF162834 has series damping resistors in the device output structure that reduce switching noise in 128-MB and 256-MB SDRAM modules. Designed with a drive capability of ±18 mA, this device is a midway drive between the ALVC162834 (±12 mA) and ALVC16834 (±24 mA).

The SN74ALVCF162834 is a faster version of the SN74ALVC162834. It is suitable for PC133 applications, particularly for SDRAM modules clocked at 133 MHz.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This 18-bit universal bus driver is designed for 2.3-V to 3.6-V VCC operation.

Data flow from A to Y is controlled by the output-enable (OE)\ input. The device operates in the transparent mode when the latch-enable (LE)\ input is low. When LE\ is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE\ is high, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE\ is high, the outputs are in the high-impedance state.

The ALVCF162834 has series damping resistors in the device output structure that reduce switching noise in 128-MB and 256-MB SDRAM modules. Designed with a drive capability of ±18 mA, this device is a midway drive between the ALVC162834 (±12 mA) and ALVC16834 (±24 mA).

The SN74ALVCF162834 is a faster version of the SN74ALVC162834. It is suitable for PC133 applications, particularly for SDRAM modules clocked at 133 MHz.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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기술 자료

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유형 직함 날짜
* Data sheet SN74ALVCF162834 datasheet (Rev. B) 2004/08/31
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 2002/08/01
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 1998/08/03
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 1998/05/13
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

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시뮬레이션 모델

SN74ALVCF162834 IBIS Model

SCEM265.ZIP (35 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
SSOP (DL) 56 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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