제품 상세 정보

Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 18 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.3 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 18 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 56 113.4 mm² 14 x 8.1 TVSOP (DGV) 56 72.32 mm² 11.3 x 6.4
  • Member of the Texas Instruments Widebus™ Family
  • Ideal for Use in PC133 Register DIMM
  • Typical Output Skew . . . <250 ps
  • VCC = 3.3 V ± 0.3 V . . . Normal Range
  • VCC = 2.7 V to 3.6 V . . . Extended Range
  • VCC = 2.5 V ± 0.2 V
  • Rail-to-Rail Output Swing for Increased Noise Margin
  • Balanced Output Drivers . . . ±18 mA
  • Low Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Widebus is a trademark of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • Ideal for Use in PC133 Register DIMM
  • Typical Output Skew . . . <250 ps
  • VCC = 3.3 V ± 0.3 V . . . Normal Range
  • VCC = 2.7 V to 3.6 V . . . Extended Range
  • VCC = 2.5 V ± 0.2 V
  • Rail-to-Rail Output Swing for Increased Noise Margin
  • Balanced Output Drivers . . . ±18 mA
  • Low Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Widebus is a trademark of Texas Instruments.

This 18-bit universal bus driver is designed for 2.3-V to 3.6-V VCC operation.

Data flow from A to Y is controlled by the output-enable (OE)\ input. The device operates in the transparent mode when the latch-enable (LE) input is high. When LE is low, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE\ is high, the outputs are in the high-impedance state.

The SN74ALVCF162835 has series damping resistors in the device output structure that reduce switching noise in 128-MB and 256-MB SDRAM modules. Designed with a drive capability of ±18 mA, this device is a midway drive between the SN74ALVC162835 (±12 mA) and SN74ALVC16835 (±24 mA).

The SN74ALVCF162835 is a faster version of the SN74ALVC162835. It is suitable for PC133 applications and, particularly, SDRAM modules clocked at 133 MHz.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This 18-bit universal bus driver is designed for 2.3-V to 3.6-V VCC operation.

Data flow from A to Y is controlled by the output-enable (OE)\ input. The device operates in the transparent mode when the latch-enable (LE) input is high. When LE is low, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE\ is high, the outputs are in the high-impedance state.

The SN74ALVCF162835 has series damping resistors in the device output structure that reduce switching noise in 128-MB and 256-MB SDRAM modules. Designed with a drive capability of ±18 mA, this device is a midway drive between the SN74ALVC162835 (±12 mA) and SN74ALVC16835 (±24 mA).

The SN74ALVCF162835 is a faster version of the SN74ALVC162835. It is suitable for PC133 applications and, particularly, SDRAM modules clocked at 133 MHz.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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기술 자료

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18개 모두 보기
유형 직함 날짜
* Data sheet SN74ALVCF162835 datasheet (Rev. A) 2004/08/05
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 2002/08/01
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 1998/08/03
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 1998/05/13
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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시뮬레이션 모델

SN74ALVCF162835 IBIS Model

SCEM260.ZIP (35 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
TSSOP (DGG) 56 Ultra Librarian
TVSOP (DGV) 56 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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