SN74ALVCH162334
- Member of the Texas Instruments Widebus™ Family
- EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
- Output Port Has Equivalent 26- Series Resistors, So No External Resistors Are Required
- Designed to Comply With JEDEC 168-Pin and 200-Pin SDRAM Buffered DIMM Specification
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
- Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages
NOTE: For tape-and-reel order entry, the DGGR package is abbreviated to GR, and the DGVR package is abbreviated to VR.
Widebus, EPIC are trademarks of Texas Instruments.
This 16-bit universal bus driver is designed for 1.65-V to 3.6-V VCC operation.
Data flow from A to Y is controlled by the output-enable (OE)\ input. The device operates in the transparent mode when the latch-enable (LE)\ input is low. When LE\ is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE\ is high, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE\ is high, the outputs are in the high-impedance state.
The output port includes equivalent 26- series resistors to reduce overshoot and undershoot.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74ALVCH162334 is characterized for operation from 40°C to 85°C.
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SSOP (DL) | 48 | Ultra Librarian |
TSSOP (DGG) | 48 | Ultra Librarian |
TVSOP (DGV) | 48 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치