홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
비인버팅 버퍼 및 드라이버
홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
비인버팅 버퍼 및 드라이버

SN74ALVCH16827

활성

버스 홀드 및 3상 출력을 지원하는 20채널, 1.65V~3.6V 버퍼

alarm알림 지금 주문
데이터 시트

SN74ALVCH16827

활성
데이터 시트 지금 주문

제품 상세 정보

Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 20 IOL (max) (mA) 24 Supply current (max) (µA) 40 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 20 IOL (max) (mA) 24 Supply current (max) (µA) 40 IOH (max) (mA) -24 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

Widebus, EPIC are trademarks of Texas Instruments.
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages

Widebus, EPIC are trademarks of Texas Instruments.

This 20-bit noninverting buffer/driver is designed for 1.65-V to 3.6-V VCC operation.

The SN74ALVCH16827 is composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1\ and 1OE2\ or 2OE1\ and 2OE2\) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH16827 is characterized for operation from -40°C to 85°C.

This 20-bit noninverting buffer/driver is designed for 1.65-V to 3.6-V VCC operation.

The SN74ALVCH16827 is composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1\ and 1OE2\ or 2OE1\ and 2OE2\) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH16827 is characterized for operation from -40°C to 85°C.
filter 기타 비인버팅 버퍼 및 드라이버 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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20개 모두 보기
유형 직함 날짜
* Data sheet SN74ALVCH16827 datasheet (Rev. D) 2004/09/02
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018/09/17
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 2002/08/01
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 1998/08/03
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 1998/05/13
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Timing Differences of 10-pF Versus 50pF Loading 1996/11/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

시뮬레이션 모델

HSPICE Model for SN74ALVCH16827

SCEJ250.ZIP (338 KB) - HSpice Model
다운로드
시뮬레이션 모델

SN74ALVCH16827 Behavioral SPICE Model

SCEM752.ZIP (7 KB) - PSpice Model
다운로드
시뮬레이션 모델

SN74ALVCH16827 IBIS Model (Rev. A)

SCEM163A.ZIP (58 KB) - IBIS Model
다운로드
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
SSOP (DL) 56 Ultra Librarian
TSSOP (DGG) 56 Ultra Librarian
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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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포럼 주제 모두 보기(영문)

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