SN74AUC1G126
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Available in TI’s NanoFree™ Package
- Optimized for 1.8-V Operation and is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial Power Down Mode and Back Drive Protection
- Sub-1 V Operable
- Maximum tpd of 2.5 ns at 1.8 V
- Low Power Consumption, 10-µA Maximum ICC
- ±8-mA Output Drive at 1.8 V
The SN74AUC1G126 bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The SN74AUC1G126 device is a single line driver with a tri-state output. The output is disabled when the output-enable (OE) input is low.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoFree™ package technology is a major breakthrough in device packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, which prevents damaging current backflow through the device when it is powered down.
기술 자료
설계 및 개발
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5-8-LOGIC-EVM — 5핀~8핀 DCK, DCT, DCU, DRL 및 DBV 패키지용 일반 논리 평가 모듈
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YZP) | 5 | Ultra Librarian |
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치