SN74LVC543A
- Operates From 1.65 V to 3.6 V
- Inputs Accept Voltages to 5.5 V
- Max tpd of 7 ns at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C - Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 250 mA Per JESD 17
This octal registered transceiver is designed for 1.65-V to 3.6-V VCC operation.
The SN74LVC543A contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate latch-enable (LEAB\ or LEBA\) and output-enable (OEAB\ or OEBA\) inputs are provided for each register to permit independent control in either direction of data flow.
The A-to-B enable (CEAB)\ input must be low to enter data from A or to output data from B. If CEAB\ is low and LEAB\ is low, the A-to-B latches are transparent; a subsequent low-to-high transition of LEAB\ places the A latches in the storage mode. With CEAB\ and OEAB\ both low, the 3-state B outputs are active and reflect the data present at the output of the A latches. Data flow for B to A is similar to that of A to B, but uses CEBA\, LEBA\, and OEBA\.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment.
관심 가지실만한 유사 제품
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비교 대상 장치와 유사한 기능
기술 자료
설계 및 개발
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14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈
14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (DW) | 24 | Ultra Librarian |
SSOP (DB) | 24 | Ultra Librarian |
TSSOP (PW) | 24 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치