SN74LVTH16501

활성

3상 출력을 지원하는 3.3V ABT 18비트 범용 버스 트랜시버

제품 상세 정보

Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -6 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -6 Input type TTL-Compatible CMOS Output type 3-State Features Bus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Very high speed (tpd 5-10ns) Technology family LVT Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Members of the Texas Instruments
    Widebus™ Family
  • UBT™ Transceiver Combines D-Type
    Latches and D-Type Flip-Flops for
    Operation in Transparent, Latched, or
    Clocked Mode
  • State-of-the-Art Advanced BiCMOS
    Technology (ABT) Design for 3.3-V
    Operation and Low Static-Power
    Dissipation
  • Support Mixed-Mode Signal Operation (5-V
    Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation
    Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot
    Insertion
  • Bus Hold on Data Inputs Eliminates the
    Need for External Pullup/Pulldown
    Resistors
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Widebus and UBT are trademarks of Texas Instruments.

  • Members of the Texas Instruments
    Widebus™ Family
  • UBT™ Transceiver Combines D-Type
    Latches and D-Type Flip-Flops for
    Operation in Transparent, Latched, or
    Clocked Mode
  • State-of-the-Art Advanced BiCMOS
    Technology (ABT) Design for 3.3-V
    Operation and Low Static-Power
    Dissipation
  • Support Mixed-Mode Signal Operation (5-V
    Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation
    Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot
    Insertion
  • Bus Hold on Data Inputs Eliminates the
    Need for External Pullup/Pulldown
    Resistors
  • Distributed VCC and GND Pins Minimize
    High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Widebus and UBT are trademarks of Texas Instruments.

The ’LVTH16501 devices are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high and OEBA is active low).

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The ’LVTH16501 devices are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high and OEBA is active low).

Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 유사한 기능
SN74ACT245 활성 TTL 호환 CMOS 입력 및 3상 출력을 지원하는 옥탈 버스 트랜시버 Voltage range (4.5V to 5.5V)

기술 자료

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17개 모두 보기
유형 직함 날짜
* Data sheet SN54LVTH16501, SN74LVTH16501 datasheet (Rev. F) 2009/08/19
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018/09/17
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note LVT-to-LVTH Conversion 1998/12/08
Application note LVT Family Characteristics (Rev. A) 1998/03/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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시뮬레이션 모델

SN74LVTH16501 IBIS Model

SCEM173.ZIP (19 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
SSOP (DL) 56 Ultra Librarian
TSSOP (DGG) 56 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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