홈 로직 및 전압 변환 버퍼, 드라이버 및 트랜시버 범용 트랜시버
홈
로직 및 전압 변환
버퍼, 드라이버 및 트랜시버
범용 트랜시버

SN74LVTH16543-EP

활성

3상 출력을 지원하는 향상된 제품 3.3V ABT 16비트 레지스터 트랜시버

지금 주문
데이터 시트

SN74LVTH16543-EP

활성
데이터 시트 지금 주문

제품 상세 정보

Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 64 IOH (max) (mA) -64 Input type TTL/CMOS Output type LVTTL Features Balanced outputs Technology family LVT Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 64 IOH (max) (mA) -64 Input type TTL/CMOS Output type LVTTL Features Balanced outputs Technology family LVT Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product–Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus™ Family
  • State–of–the–Art Advanced BiCMOS Technology (ABT) Design for 3.3–V Operation and Low Static–Power Dissipation
  • Supports Mixed–Mode Signal Operation (5–V Input and Output Voltages With 3.3–V VCC)
  • Supports Unregulated Battery Operation Down to 2.7 V
  • Ioff and Power–Up 3–State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Distributed VCC and GND Pins Minimize High–Speed Switching Noise
  • Flow–Through Architecture Optimizes PCB Layout
  • Latch–Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL–STD–883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

(1)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Widebus Is a trademark of Texas Instruments
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product–Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus™ Family
  • State–of–the–Art Advanced BiCMOS Technology (ABT) Design for 3.3–V Operation and Low Static–Power Dissipation
  • Supports Mixed–Mode Signal Operation (5–V Input and Output Voltages With 3.3–V VCC)
  • Supports Unregulated Battery Operation Down to 2.7 V
  • Ioff and Power–Up 3–State Support Hot Insertion
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Distributed VCC and GND Pins Minimize High–Speed Switching Noise
  • Flow–Through Architecture Optimizes PCB Layout
  • Latch–Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL–STD–883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)

(1)Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Widebus Is a trademark of Texas Instruments

The SN74LVTH16543 is a 16–bit registered transceiver designed for low–voltage (3.3–V) VCC operation, but with the capability to provide a TTL interface to a 5–V system environment. This device can be used as two 8–bit transceivers or one 16–bit transceiver. Separate latch–enable (LEAB or LEBA) and output–enable (OEAB or OEBA) inputs are provided for each register to permit independent control in either direction of data flow.

The A–to–B enable (CEAB) input must be low to enter data from A or to output data from B. If CEAB is low and LEAB is low, the A–to–B latches are transparent; a subsequent low–to–high transition of LEAB puts the A latches in the storage mode. With CEAB and OEAB both low, the 3–state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA, LEBA, and OEBA inputs.

Active bus–hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.5 V, the device is in the high–impedance state during power up or power down. However, to ensure the high–impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current–sinking capability of the driver.

This device is fully specified for hot–insertion applications using Ioff and power–up 3–state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power–up 3–state circuitry places the outputs in the high–impedance state during power up and power down, which prevents driver conflict.

The SN74LVTH16543 is a 16–bit registered transceiver designed for low–voltage (3.3–V) VCC operation, but with the capability to provide a TTL interface to a 5–V system environment. This device can be used as two 8–bit transceivers or one 16–bit transceiver. Separate latch–enable (LEAB or LEBA) and output–enable (OEAB or OEBA) inputs are provided for each register to permit independent control in either direction of data flow.

The A–to–B enable (CEAB) input must be low to enter data from A or to output data from B. If CEAB is low and LEAB is low, the A–to–B latches are transparent; a subsequent low–to–high transition of LEAB puts the A latches in the storage mode. With CEAB and OEAB both low, the 3–state B outputs are active and reflect the data present at the output of the A latches. Data flow from B to A is similar, but requires using the CEBA, LEBA, and OEBA inputs.

Active bus–hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When VCC is between 0 and 1.5 V, the device is in the high–impedance state during power up or power down. However, to ensure the high–impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current–sinking capability of the driver.

This device is fully specified for hot–insertion applications using Ioff and power–up 3–state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power–up 3–state circuitry places the outputs in the high–impedance state during power up and power down, which prevents driver conflict.
filter 기타 범용 트랜시버 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
19개 모두 보기
유형 직함 날짜
* Data sheet SN74LVTH16543-EP datasheet (Rev. B) 2006/06/16
* VID SN74LVTH16543-EP VID V6204715 2016/06/21
* Radiation & reliability report CLVTH16543IDGGREP Reliability Report 2014/12/22
* Radiation & reliability report CLVTH16543MDLREP Reliability Report 2014/12/22
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
Selection guide Advanced Bus Interface Logic Selection Guide 2001/01/09
Application note LVT-to-LVTH Conversion 1998/12/08
Application note LVT Family Characteristics (Rev. A) 1998/03/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

패키지 핀 CAD 기호, 풋프린트 및 3D 모델
SSOP (DL) 56 Ultra Librarian
TSSOP (DGG) 56 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상