CDC3RL02
- Low Additive Noise:
- –149dBc/Hz at 10kHz Offset Phase Noise
- 0.37ps (RMS) Output Jitter
- Limited Output Slew Rate for EMI Reduction (1ns to 5ns Rise/Fall Time for 10pF to 50pF Loads)
- Adaptive Output Stage Controls Reflection
- Regulated 1.8V Externally Available I/O Supply
- Ultra-Small 8-bump YFP 0.4mm Pitch WCSP (0.8mm × 1.6mm)
- ESD Performance Exceeds JESD 22
- 2000V Human-Body Model (A114-A)
- 1000V Charged-Device Model (JESD22-C101-A Level III)
The CDC3RL02 is a two-channel clock fan-out buffer and is designed for use in portable end-equipment, such as mobile phones, that require clock buffering with minimal additive phase noise and fan-out capabilities. The device buffers a single clock source, such as a temperature compensated crystal oscillator (TCXO) to multiple peripherals. The device has two clock request inputs (CLK_REQ1 and CLK_REQ2), each input can enable a single clock output.
The CDC3RL02 accepts square or sine waves at the master clock input (MCLK_IN), eliminating the need for an AC coupling capacitor. The smallest acceptable sine wave is a 0.3V signal (peak-to-peak). CDC3RL02 is designed to offer minimal channel-to-channel skew, additive output jitter, and additive phase noise. The adaptive clock output buffers offer controlled slew-rate over a wide capacitive loading range which minimizes EMI emissions, maintains signal integrity, and minimizes ringing caused by signal reflections on the clock distribution lines.
The CDC3RL02 has an integrated Low-Drop-Out (LDO) voltage regulator which accepts input voltages from 2.3V to 5.5V and outputs 1.8V, 50mA. This 1.8V supply is externally available to provide regulated power to peripheral devices such as a TCXO.
The CDC3RL02 is offered in a 0.4mm pitch die size ball grid array (DSBGA) package (0.8mm × 1.6mm), also known as wafer-level chip-scale (WCSP) package, and is optimized for very low standby current consumption.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | CDC3RL02 Low Phase-Noise Two-Channel Clock Fan-Out Buffer datasheet (Rev. H) | PDF | HTML | 2024年 10月 9日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
CLOCK-TREE-ARCHITECT — 時鐘樹架構程式設計軟體
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YFP) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。