CDCS503
- Part of a Family of Easy to use Clock Generator Devices
With Optional SSC - Clock Multiplier With Selectable Output Frequency and
Selectable SSC - SSC Controllable via 2 External Pins
- ±0%, ±0.5%, ±1%, ±2% Center Spread
- Frequency Multiplication Selectable Between x1 or x4
With One External Control Pin - Output Disable via Control Pin
- Single 3.3V Device Power Supply
- Wide Temperature Range –40°C to 85°C
- Low Space Consumption by 8 Pin TSSOP Package
- APPLICATIONS
- Consumer and Industrial Applications requiring
EMI reduction through Spread Spectrum Clocking
and/or Clock Multiplication
- Consumer and Industrial Applications requiring
The CDCS503 is a spread spectrum capable, LVCMOS Input Clock Buffer with selectable frequency multiplication.
It shares major functionality with the CDCS502 but utilizes a LVCMOS input stage instead of the crystal input stage of the CDCS502. Also an Output Enable pin has been added to the CDCS503.
The device accepts a 3.3V LVCMOS signal at the input.
The input signal is processed by a PLL, whose output frequency is either equal to the input frequency or multiplied by the factor of 4.
The PLL is also able to spread the clock signal by ±0%, ±0.5%, ±1% or ±2% centered around the output clock frequency with a triangular modulation.
By this, the device can generate output frequencies between 8MHz and 108MHz with or without SSC.
A separate control pin can be used to enable or disable the output. The CDCS503 operates in 3.3V environment.
It is characterized for operation from 40°C to 85°C, and available in an 8-pin TSSOP package.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Clock Buffer / Clock Multiplier with optional SSC datasheet | 2009年 3月 23日 | |
Application note | Spread Spectrum Clocking Using the CDCS502/503 | 2009年 8月 19日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。