SN74LVC138A-Q1
- Qualified for Automotive Applications
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Operates From 2 V to 3.6 V
- Inputs Accept Voltages to 5.5 V
- Max tpd of 5.8 ns at 3.3 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
The SN74LVC138A 3-line to 8-line decoder/demultiplexer is designed for 2.7-V to 3.6-V VCC operation.
The device is designed for high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, this decoder minimizes the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, delay times of this decoder and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoder is negligible.
The conditions at the binary-select inputs and the three enable inputs select one of eight output lines. Two active-low enable inputs and one active-high enable input reduce the need for external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing applications.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.
您可能會感興趣的類似產品
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點